Dan’s Biz Bookshelf: ‘Dream First, Details Later
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
Facing the Future: Time for Real Talk, Early and Often, Between Design and Fabrication
Delving Into Special Sessions at IPC APEX EXPO 2024
May 28, 2024 | Happy Holden, I-Connect007Estimated reading time: 1 minute
Once again, we were back at IPC APEX EXPO for another show and conference, and back to gathering in the Anaheim Convention Center. With Disneyland just across the street, there were tourists everywhere.
This APEX EXPO was bigger than ever, with more activities, Professional Development Courses, standards committee meetings, and the 16th Electronic Circuits World Convention. I really enjoyed walking around and seeing everything the show had to offer.
After an excellent keynote on Tuesday by Paul Bailey titled “The Art of the Impossible,” the show opened, and a large crowd surged in. I spent the day walking the aisles and looking at all the technologies. One factor that kept recurring was the use of artificial intelligence (AI) as a catchphrase. It was difficult to really understand what part of AI was being employed, but it was the use of rule-based learning of errors that could then be used to correct the root causes. Many of the Real Time With… interviews conducted in the I-Connect007 booth discussed the prevalence of AI.
One of the highlights for me was the Taiwan High-Tech Forum on Wednesday, presented by the Taiwan Printed Circuit Association (TPCA). TSMC provided opening remarks about the super-IC fabrication for the world. They showed a very slick video about their processes and packaging. Other Taiwan luminaries, including the Industrial Technology Research Institute (ITRI), gave an overview of its research for IC packaging and critical materials. This was followed by key Taiwan packaging substrate suppliers like Unimicron and Kinsus Interconnect Technology Corp., where leaders reviewed their technologies, capabilities, and materials. As the day went on, it seemed that the presentations were increasingly about marketing rather than technical presentations, as very few facts and data were presented; it was more about products and capabilities.
To read this entire article, which appeared in the 2024 issue of Show & Tell Magazine, click here.
Share on:
Suggested Items
I-Connect007 Observes U.S. Independence Day Holiday
07/04/2025 | Nolan Johnson, I-Connect007Today marks the 248th anniversary of the signing of the American Declaration of Independence by the Continental Congress. Known widely in the U.S. as Independence Day or “The Fourth of July,” this day also commemorates the declaration by the Congress that the American colonies are free and independent states.
MRSI Systems, LLC Files Patent Infringement Lawsuit Against Suzhou LieQi in China
06/16/2025 | MRSI Systems, LLCMRSI Systems, LLC (a part of Mycronic Group), a global high-tech company that provides high precision production solution in electronics industry, filed a patent infringement lawsuit against Suzhou LieQi Intelligent Equipment Co., Ltd. (SZLQ) with Shenzhen Intermediate People’s Court for infringement of MRSI Systems’ patent related to die bonder (Case No. (2025) YUE03minchu No. 7154).
Project GENESIS Minimizes Ecological Footprint in Europe’s Semiconductor Industry
06/06/2025 | Fraunhofer IPMSA pan-European consortium dedicated to developing sustainable processes and technologies for the semiconductor-manufacturing supply chain announces the launch of the GENESIS project.
Zhen Ding Promotes Digital Transformation and Embraces AI Business Opportunities
06/06/2025 | Zhen Ding TechnologyOn May 27, 2025, General Manager Chen-Fu Chien of Zhen Ding Technology Group was invited to attend the "2025 Two Thousand Forum" held by The CommonWealth Magazine.
IMI Signs Share Purchase Agreement to Sell Its Czech Republic Manufacturing Site
06/06/2025 | IMIIntegrated Micro-Electronics Inc (IMI), through its wholly-owned subsidiary, Coöperatief IMI Europe U.A., has signed a share purchase agreement to sell 100% of the shares in IMI Czech Republic (IMI CZ) to KEBODA Deutschland GmbH & Co. KG, a subsidiary of Keboda Technology Co., Ltd. (Keboda), a publicly listed company in China.