-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Delving Into Special Sessions at IPC APEX EXPO 2024
May 28, 2024 | Happy Holden, I-Connect007Estimated reading time: 1 minute

Once again, we were back at IPC APEX EXPO for another show and conference, and back to gathering in the Anaheim Convention Center. With Disneyland just across the street, there were tourists everywhere.
This APEX EXPO was bigger than ever, with more activities, Professional Development Courses, standards committee meetings, and the 16th Electronic Circuits World Convention. I really enjoyed walking around and seeing everything the show had to offer.
After an excellent keynote on Tuesday by Paul Bailey titled “The Art of the Impossible,” the show opened, and a large crowd surged in. I spent the day walking the aisles and looking at all the technologies. One factor that kept recurring was the use of artificial intelligence (AI) as a catchphrase. It was difficult to really understand what part of AI was being employed, but it was the use of rule-based learning of errors that could then be used to correct the root causes. Many of the Real Time With… interviews conducted in the I-Connect007 booth discussed the prevalence of AI.
One of the highlights for me was the Taiwan High-Tech Forum on Wednesday, presented by the Taiwan Printed Circuit Association (TPCA). TSMC provided opening remarks about the super-IC fabrication for the world. They showed a very slick video about their processes and packaging. Other Taiwan luminaries, including the Industrial Technology Research Institute (ITRI), gave an overview of its research for IC packaging and critical materials. This was followed by key Taiwan packaging substrate suppliers like Unimicron and Kinsus Interconnect Technology Corp., where leaders reviewed their technologies, capabilities, and materials. As the day went on, it seemed that the presentations were increasingly about marketing rather than technical presentations, as very few facts and data were presented; it was more about products and capabilities.
To read this entire article, which appeared in the 2024 issue of Show & Tell Magazine, click here.
Suggested Items
Plexus Marks Zero Waste Day with Significant Reductions in Electronic Waste
03/28/2025 | PlexusThe global surge in electronic waste, increasing by 82% since 2010 and projected to reach a staggering 82 million tons by 2030, demands immediate and effective action. In response, Plexus Corp., is demonstrating its commitment to sustainability by achieving significant waste reduction milestones at its European facilities.
Indonesia PC Market Grew 8.8% In 2024, Driven by Consumers
03/28/2025 | IDCAccording to the International Data Corporation (IDC) Worldwide Personal Computing Device Tracker, Indonesia's PC market saw a total of 4.1M shipments of desktops, notebooks, and workstations in 2024. This volume represents an 8.8% year-over-year (YoY) growth.
Electroninks' MOD and iSAP Game Changers
03/25/2025 | Marcy LaRont, PCB007 MagazineElectroninks, a prominent player in particle-free conductive inks, recently announced an exciting new range of metal-complex inks for ultra high density interconnect (UHDI) technology. At the SMTA UHDI Symposium in January, Mike Vinson, COO of Electroninks, gave a presentation on this line of MOD inks, which are versatile and suitable for a range of applications that require ultra-dense, miniaturized, and high-frequency technology. Mike says his technology is a game changer and will revolutionize UHDI circuit fabrication.
Dr. Thomas Marktscheffel of ASMPT Honored for his Work on Open Interfaces
03/25/2025 | ASMPTDr. Thomas Marktscheffel, Director Product Management Software Solutions at ASMPT, was honored by the IPC at this year's IPC APEX EXPO in Anaheim, California, for his many years of commitment to the organization. The non-proprietary interface standards he helped develop form the basis for ASMPT’s intelligent factory concept.
Schmoll: Decades of Technology Evolution
03/24/2025 | Kurt Palmer -- Column: Driving Innovation in Mechanical and Optical ProcessesIn this first column we look back at Schmoll’s history, building a business of manufacturing PCB drilling machines, examining key technological milestones, and demonstrating how challenges were addressed over the years. In future columns, we will discuss current industry challenges, technological advancements, and anticipated trends shaping PCB manufacturing. Looking back at the past and reflecting on the lessons learned is always an insightful and valuable journey.