Best Student Poster: Drop Shock Reliability
May 29, 2024 | Michelle Te, I-Connect007Estimated reading time: 1 minute
![](https://iconnect007.com/application/files/7017/1695/9895/poster_winners_300.jpg)
Two Auburn University doctoral candidates authored a poster on drop shock performance of solder alloys in BGA assemblies that won Best Student Poster at IPC APEX EXPO 2024. They received a $750 cash prize and a $2,000 scholarship.
Palash Vyas is a Ph.D. candidate in the Department of Industrial Engineering with more than three years of research experience in reliability testing of PCBs. His paper was co-authored by Soroosh Alavi, who has bachelor’s and master’s of science degrees in industrial engineering and is now in his third year as a doctoral student in industrial and systems engineering, while also working on a master’s degree in data science.
Both students are well-known to the IPC Education Foundation. Palash is a former president of the IPC Student Chapter at Auburn University. He also won Best Student Paper in 2022 for solder joint reliability during thermal cycling. Soroosh joined his IPC Student Chapter at Auburn in 2022. Both have won member and leadership scholarships over the past four years.
Of their 2024 poster, the judges noted that “the research is very novel” and “there is not a lot of research in this area of drop shock test of PCBs at elevated temperatures.” The judges said Palash and Soroosh have a good understanding of the subject matter.
Julia Flynn, IPC professional development coordinator, said the Technical Program Committee members who reviewed their poster “were impressed,” and gave them high scores all around for the technical content.
“I am deeply honored to have received the Best Poster Award,” Palash said. “Apart from alleviating the financial burden of tuition, the award will help strengthen my belief in my potential to make a difference in the electronics industry. It will greatly boost my motivation as a researcher.”
“The award is deeply meaningful to me,” Soroosh said. “It validates the hard work and dedication I’ve invested in my research and reassures me that my contributions are valuable to the field. This recognition not only motivates me to continue pushing the boundaries of what I can achieve but also reinforces my commitment to making impactful advancements in the industry.”
To read this entire article, which appeared in the 2024 issue of Show & Tell Magazine, click here.
Suggested Items
Zhen Ding Posts August 2024 Monthly Revenue Report
09/06/2024 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, today reported August 2024 revenue of NT$17,814 million, up 29.2% YoY and up 32.4% MoM, setting a record high for the same period in the company’s history
AMOLED Panels Become Mainstream Display for Smartphones, with Shipments Set to Grow by Nearly 25% in 2024
09/06/2024 | TrendForceTrendForce’s latest projections show global shipments of AMOLED smartphone panels are anticipated to surpass 840 million units in 2024, reflecting a remarkable growth of almost 25% from 2023.
MICRONOX MX2123 to Lead KYZEN Offerings at The International Symposium on Microelectronics
09/05/2024 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at The 2024 International Symposium on Microelectronics scheduled to take place October 1-3, 2024 at the Encore Boston Harbor.
Q2 2024 Global Semiconductor Equipment Billings Increased 4% Year-Over-Year
09/05/2024 | SEMIGlobal semiconductor equipment billings increased 4% year-over-year to US$26.8 billion in the second quarter of 2024, while quarter-over-quarter billings edged up 1% during the same p
NVIDIA’s Data Center Business Fuels Explosive Growth in FY2Q25 Revenue; H200 Set to Dominate AI Server Market from 2H24
09/04/2024 | TrendForceTrendForce’s latest findings show that NVIDIA’s data center business is driving a remarkable surge in the company’s revenue, which more than doubled in the second quarter of its 2025 fiscal year to reach an impressive US$30 billion.