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Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology

04/17/2024 | Real Time with...IPC APEX EXPO
Editor Nolan Johnson talks with Neil Hubble, president of Akrometrix, about the company's leadership in thermal, warpage, and strain metrology. Neil details how Akrometrix is committed to addressing customer challenges through technological evolution, innovative solutions, and a focus on data processing. A tabletop unit for thermal warpage testing is showcased at IPC APEX EXPO this year.

Indium’s Wisdom Qu to Present at SMTA China South Technical Conference

09/29/2023 | Indium Corporation
Indium Corporation Regional Product Manager Wisdom Qu will present at the SMTA China South Technical Conference, held in conjunction with NEPCON Asia, on October 11 in Shenzhen, China.

SHENMAO's New Anti-HoP Lead-Free Solder Paste Developed to Prevent HoP Issues

03/13/2023 | SHENMAO America, Inc.
SHENMAO America, Inc. has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow (HoP) issues.

SHENMAO Offers Low-Temperature Lead-Free Solder Paste PF735-PQ10-10L for High-Speed Printing

02/22/2023 | SHENMAO
SHENMAO America, Inc. has released its PF735-PQ10-10L Low Melting Point Lead-Free Solder Paste. The paste has been designed specifically for the SMT process and is applicable to the high-speed printing process to increase production capacity.

iNEMI Call for Participation: Package Warpage Prediction Project

01/04/2023 | iNEMI
iNEMI is continuing a series of projects addressing package warpage challenges with Phase 6 of the Package Warpage Prediction and Characterization project.
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