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CACI Awarded $805 Million Task Order to Provide Engineering Support and Technology to U.S. Navy’s NavalX Office

10/22/2024 | CACI International Inc.
CACI International Inc  announced that it has been awarded a five-year task order valued at up to $805 million to provide engineering support and technology to the U.S. Navy’s NavalX Office under the Department of Defense Information Analysis Center’s (DoD IAC) multiple-award contract (MAC) vehicle.

Siemens Launches Digital Decarbonization Tool at Climate Week NYC to Help Simplify the Path to Net-Zero Facilities

09/27/2024 | BUSINESS WIRE
Siemens Financial Services launched the Decarbonization Business Optimizer (DBO), a cloud-based tool created to help address the overwhelming complexity of decarbonizing buildings and the financing needed to get to net-zero emissions.

EDA Market to Grow $8.7 Billion (2024-2028) with AI's Rising Impact on Trends

09/19/2024 | PRNewswire
The market is estimated to grow at a CAGR of 10.26%  during the forecast period. Growing significance of EDA in electronic design process is driving market growth, with a trend towards machine learning disrupting global EDA market

Jabil CEO Michael Dastoor Appointed to Board of Directors

09/13/2024 | Jabil
Jabil Inc. announced that CEO Michael Dastoor has been appointed to the company’s Board of Directors. This appointment follows Dastoor's recent promotion to CEO in May 2024.

Beyond Design: Integrated Circuit to PCB Integration

09/11/2024 | Barry Olney -- Column: Beyond Design
Technologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.
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