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Suggested Items

Tech Trajectories: Projecting Trend Advancements

09/25/2024 | Srikanth Chandrasekaran, IEEE SA
Reflecting on technological advancements and examining how foundational technology trends evolve is essential to seeing where the world and society are headed. Last year, significant strides were made in data governance, automation, edge computing, artificial intelligence (AI), and the metaverse. IEEE Standards Association (IEEE SA) is keeping its eye on what’s ahead for these technologies that are transforming various industry sectors. In this article, I’ll examine the current state of these technologies and outline the advancements and directions we expect ahead.

Compal RMM-T1 Module Achieves Skylo Certification and FCC Approval

09/20/2024 | Compal Electronics Inc.
Compal is pleased to announce that its RMM-T1 module has successfully obtained Skylo certification and received approval from the Federal Communications Commission (FCC).

IPC Releases Newest List of Standards Updates, Revisions

09/16/2024 | IPC Community Editorial Team
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q3 2024.

Audits: A Critical Element of Process Control

09/03/2024 | Randy Cherry, IPC
A formal audit always seems difficult to justify. Companies do not want the expense, and employees do not want the hassle. There is always a chance of failure, and management struggles to understand the benefits. If you or your company has had issues with auditing, hopefully, this article will help you feel a little more comfortable about the auditing process.

Give Yourself an Edge at the IPC High Reliability Forum 2024

08/27/2024 | Marcy LaRont, PCB007 Magazine
For those who support military and defense products, few topics are more important than reliability, particularly as we venture into complex packaging requirements that accommodate next-gen chips and electronic systems. Recently, I visited with Teresa Rowe, IPC senior director, assembly and standards technology, to discuss the IPC High Reliability Forum (HRF), Oct. 9-10, at the McKimmon Center, in Raleigh, North Carolina. With topics that cover high-voltage electronics, standardized test methods, and assembly and solder joint X-ray challenges, it is clear that this event needs to be included on your annual conference calendar.
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