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IPC Releases Newest List of Standards Updates, Revisions
June 3, 2024 | IPCEstimated reading time: Less than a minute
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q2.
IPC-7711/21D
Rework, Modification and Repair of Electronic Assemblies
IPC-7711/21D provides guidance on procedures for rework, repair, and modification of printed board and cable or wire harness assemblies. IPC-7711/21D provides the requirements, tools, and materials to be used in the rework, repair, and modification of electronic products and for cable or wire harness assemblies.
IPC-2221C
Generic Standard on Printed Board Design
IPC-2221C establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures, including PC card form factors. The organic materials may be homogeneous, reinforced, or used in combination with organic materials; the interconnections may be single, double, or multilayered.
To find out the rest of the newest standards, which were published in the Spring 2024 issue of IPC Community, click here.
Suggested Items
Tech Trajectories: Projecting Trend Advancements
09/25/2024 | Srikanth Chandrasekaran, IEEE SAReflecting on technological advancements and examining how foundational technology trends evolve is essential to seeing where the world and society are headed. Last year, significant strides were made in data governance, automation, edge computing, artificial intelligence (AI), and the metaverse. IEEE Standards Association (IEEE SA) is keeping its eye on what’s ahead for these technologies that are transforming various industry sectors. In this article, I’ll examine the current state of these technologies and outline the advancements and directions we expect ahead.
Compal RMM-T1 Module Achieves Skylo Certification and FCC Approval
09/20/2024 | Compal Electronics Inc.Compal is pleased to announce that its RMM-T1 module has successfully obtained Skylo certification and received approval from the Federal Communications Commission (FCC).
IPC Releases Newest List of Standards Updates, Revisions
09/16/2024 | IPC Community Editorial TeamEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q3 2024.
Audits: A Critical Element of Process Control
09/03/2024 | Randy Cherry, IPCA formal audit always seems difficult to justify. Companies do not want the expense, and employees do not want the hassle. There is always a chance of failure, and management struggles to understand the benefits. If you or your company has had issues with auditing, hopefully, this article will help you feel a little more comfortable about the auditing process.
Give Yourself an Edge at the IPC High Reliability Forum 2024
08/27/2024 | Marcy LaRont, PCB007 MagazineFor those who support military and defense products, few topics are more important than reliability, particularly as we venture into complex packaging requirements that accommodate next-gen chips and electronic systems. Recently, I visited with Teresa Rowe, IPC senior director, assembly and standards technology, to discuss the IPC High Reliability Forum (HRF), Oct. 9-10, at the McKimmon Center, in Raleigh, North Carolina. With topics that cover high-voltage electronics, standardized test methods, and assembly and solder joint X-ray challenges, it is clear that this event needs to be included on your annual conference calendar.