Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Element Solutions Declares Q3 Dividend of $0.08 Per Share

08/22/2025 | BUSINESS WIRE
Element Solutions Inc announced that its board has declared a quarterly cash dividend of $0.08 per share of the company's common stock. The declared dividend will be paid on September 15, 2025 to stockholders of record as of the close of business on September 2, 2025.

Polymatech Electronics Limited Announces Completion of PCB Manufacturing Facility in Europe

08/15/2025 | PR Newswire
Polymatech Electronics Limited is thrilled to announce the successful commissioning of its state-of-the-art Printed Circuit Board (PCB) manufacturing facility in Estonia, Europe. This milestone represents a significant advancement in the company's strategic expansion across the European market.

MacDermid Alpha Electronics Solutions Announces New Strategy Vice President Role for India

08/14/2025 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is pleased to announce the appointment of Dr. Ravi Bhatkal to the newly created role of Vice President, Strategy, India.

Changes in Management Positions at Würth Elektronik eiSos Group

08/14/2025 | Wurth Elektronik eiSos
Würth Elektronik, a leading manufacturer of electronic and electromechanical components for the electronics industry, announces two new appointments at the management level: Dirk Knorr has taken over the position of COO of the Würth Elektronik eiSos Group, and Sebastian Valet has taken over his previous position as Managing Director of Würth Elektronik eiSos GmbH & Co. KG.

Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India

08/14/2025 | Koh Young
Koh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in