-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueTechnology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Koh Young at SEMICON West with a Focus on Inspection & Metrology for Semiconductor and Advanced Packaging Challenges
June 4, 2024 | Koh YoungEstimated reading time: 1 minute
Koh Young, the industry leader in True3D measurement-based inspection solutions, will demonstrate its ZenStar and Meister Series of automated inspection and metrology tools for semiconductor and advanced package applications in booth 1833 at SEMICON West, taking place from July 9-11, 2024, at the Moscone Center in San Francisco, CA.
For over two decades, Koh Young has been a global leader in the field of 3D inspection and measurement technology. Our journey began with a vision to enhance precision and efficiency in electronics manufacturing. Today, we stand at the forefront of revolutionizing the semiconductor industry with our innovative metrology solutions. Using our True3D™ measurement-based inspection technologies, including the ZenStar and Meister Series, manufacturers can tackle critical manufacturing challenges in advanced packaging. These technologies provide real-time insights and predictive analytics to drive smarter manufacturing decisions, achieve higher yields, reduce defects, and improve overall productivity.
Meister S Premium In-line 3D Inspection System for Micro Solder Paste Deposits
Combining innovative vision algorithms and high-resolution optic technology, the Meister S is the ultimate, True 3D SPI solution for the semiconductor & Mini/Micro-LED packaging process improvement.
- High-resolution optics with a high-speed camera system (0.1 µm Z resolution)
- High-speed 25 Mega-pixel Camera with 3.5-micron Resolution Optics
- 10-micron Thins Solder Paste Inspection
- Colored and Transparent Flux Inspection
Meister D+ Breakthrough in 3D Measurement for Highly Reflective, Shiny Die
The Meister D+ combines industry-leading Moiré technology to inspect for micro cracks, chipping, foreign material, and more and our new proprietary optics to support highly-reflective die inspection, a challenge historically plaguing the industry.
- Small Die and Component Inspection (0201 metric / 008004 EIA)
- Narrow-gap Inspection down to 50-microns
- Height and Tilt Measurement in High Density, Highly Reflective Applications
ZenStar True 3D Measurement for Wafer-level Packaging Applications
Combining innovative vision algorithms and high-resolution optical technology, the ZenStar inspects highly reflective die as well as components. With proprietary deep learning technology, it offers enhanced capabilities to inspect defects like micro-cracks, foreign material, chipping, and more.
- Industry-leading metrology capabilities with deep learning technology
- 10-micron diameter wafer bump inspection
- Full 3D height and tilt measurement for even highly reflective die surfaces
Suggested Items
TRI Releases Core Features 3D AOI Solution
09/23/2024 | TRITest Research, Inc. (TRI) is pleased to introduce the Core Features 3D AOI, TR7700QC SII, equipped with essential inspection functionalities tailored for the electronics manufacturing industry.
INSPECTIS’ Extended Reach BGA-XL Stand for Larger PCBAs Joins Higher Magnification XM Lenses
09/23/2024 | INSPECTISUltra-low clearance BGAs on large PCBAs are no problem to optically inspect now, because INSPECTIS’ BGA-XL stand will reach them, while optional new XM lenses will get you under them – offering up to 285x screen magnification.
ViTrox Showcases Cutting-Edge VisionXpert Smart Code Readers at SMTA Penang 2024
09/17/2024 | ViTroxViTrox, which aims to be the World’s Most Trusted Technology Company, is excited to announce its participation in the SMTA Penang at Table #37 in the AC Hotel, Penang on 25-26 September 2024.
MEK Launches New PowerSpector JSAz 550: Larger 3D Desktop AOI System with New Chassis
09/11/2024 | MEKMek (Marantz Electronics), a leader in Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) technology, proudly announces the launch of its latest product, the PowerSpector JSAz 550. This new selective 3D desktop AOI system is a larger L-size model, capable of accommodating Printed Circuit Boards (PCBs) up to 550x550mm (21.7”x21.7”).
Zero Defects International to Exhibit at Utah Expo and Tech Forum
09/04/2024 | Zero Defects InternationalZero Defects International [ZDI] has announced their participation as an exhibitor at the SMTA Utah Expo and Tech Forum. It will be held at the Salt Lake City Marriott University Park.