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For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 27, 2024 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

If you know Dave Hoover of TTM, then I am honored to inform you that he has retired from the industry as of this week. Dave and I met about six years ago, at a conference, when we were introduced by my colleague Andy Shaughnessy. We quickly established a shared love for American blues music; we even had mutual music industry friends. Dave has been a wealth of industry knowledge for me, just as he has influenced so many of us throughout the years. I’m sure I speak for all who know him that he’ll be missed in the industry. But we can keep tabs on him through his weekly online blues radio program “Groovy Hoovy’s Different Shades of Blue Radio and Video Show.” Congratulations on your transition to “civilian” life, Dave.
This week’s editor’s picks are a real potpourri of industry news items and a bonus column. There's a lot happening in our segment of the electronics world. We'll be covering the Anaheim Electronics Manufacturing Show next week, PCB West after that, followed up by SMTA International. We hope to see you there.
Biden-Harris Administration Announces First CHIPS Award to Polar Semiconductor, Establishing U.S. Foundry
Published September 25
The CHIPS Act money is starting to roll out. In this case, the funds will be used to expand and update the fab in Bloomington, Minnesota. Undoubtedly there will be more news like this in coming weeks and months, and we’ll bring you that news. It will be interesting to see just how much impact the CHIPS investment will have on U.S. manufacturing.
Connect the Dots: Designing for Reality: Outer Layer Imaging
Published September 26
ASC/Sunstone’s Matt Stevenson has been documenting the PCB fabrication process in great detail lately. If you haven’t listened to his podcast series at “On The Line With..” you should (find it at most of the major podcast sites). In this column, Matt adds additional detail on outer layer imaging. If you’re a designer, you should give this a read.
AI to Boost Wafer Foundry Market by 20%
Published September 19
The wafer foundry market is expected to see a recovery in 2025, with an estimated annual growth of 20%, up from 16% in 2024. This is happening while many components have had their manufacturing scaled back to meet lessened demand. But components specific to AI infrastructure are at the root of this growth number. Learn more here.
iNEMI Announces End-of-Project Webinar for PCB Connector Footprint Tolerance Project
Published September 23
Designers and assemblers may find value in this webinar, scheduled for Sept. 30, 2024. The project’s objective was to equip product designers with the necessary information to ensure predictable quality levels when using high-bandwidth connectors. Through a comprehensive literature review and the expertise of the project team, potential risks were identified, followed by the creation of a survey designed to assess supplier capabilities for quality mitigation in the PCB industry.
North American PCB Industry Sales Up 35% in August
Published September 23
That headline is very large when it comes to sales numbers. The 35% refers to the previous year comparison (not to spoil the surprise). The rest of the report might be less rosy, but the news is not exactly bad. Read more here.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/13/2025 | Marcy LaRont, I-Connect007Today is Friday the 13th, and in much of Western folklore, this is a day when bad luck is lurking. But while Friday the 13th may top Western superstition charts, the global calendar is sprinkled with its own unlucky legends. In Spain and Greece, the bad juju lands on Tuesday the 13th—a day linked to Mars, the god of war, and naturally, chaos. In Italy, it’s Friday the 17th that is feared, thanks to the Roman numeral XVII, which can be rearranged to spell VIXI—Latin for “I have lived” (a poetic way of saying you’re dead).
Priority Software Appoints Ben Karniel as Chief Revenue Officer to Spearhead Global Growth
06/12/2025 | Priority SoftwarePriority Software, a leading provider of scalable and agile cloud-based business management solutions, proudly announces the appointment of Ben Karniel as its new Chief Revenue Officer (CRO), effective May 1, 2025. This strategic addition to the executive team underscores Priority's commitment to expand its global footprint.
Roll-to-Roll Technologies for Flexible Devices Set to Grow at 11.5% CAGR
06/11/2025 | GlobeNewswireAccording to the latest study from BCC Research, the “Global Markets for Roll-to-Roll Technologies for Flexible Devices” is expected to reach $69.8 billion by the end of 2029 at a compound annual growth rate (CAGR) of 11.5% from 2024 to 2029.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
Bridging the Knowledge Gap in Test: A Conversation with Bert Horner
06/11/2025 | Barry Matties, I-Connect007Bert Horner is a seasoned industry veteran and co-creator of The Test Connection, Inc. (TTCI), a test and inspection company spanning over 45 years. In this candid conversation, Bert reflects on the challenges our industry faces with the retirement of career professionals and the subsequent loss of critical tribal knowledge. As he unveils The Training Connection’s innovative training initiatives, Bert emphasizes the importance of evolving educational programs that align with industry needs, particularly in design for test (DFT), and sheds light on strategies being implemented to foster the next generation of engineers.