The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
TRI Releases Core Features 3D AOI Solution
September 23, 2024 | TRIEstimated reading time: Less than a minute
Test Research, Inc. (TRI) is pleased to introduce the Core Features 3D AOI, TR7700QC SII, equipped with essential inspection functionalities tailored for the electronics manufacturing industry.
The Core Features 3D AOI features user-friendly programming for easy setup, flexible IPC-610 inspection algorithms, optional AI-powered solutions, and compliance with the latest Smart Factory standards. Featuring a 12 MP High-Speed Camera, it offers four factory-setting configurations ranging from high-resolution 10 μm to high-speed 15 μm.
Powered by IPC-610-compliant algorithms, the 3D AOI system can inspect the most intricate solder joint defects, including THT components. Interactive 3D models help operators quickly review detected defects, such as lifted BGA components, IC leads, connectors, switches, and other mounted devices.
The TR7700QC SII also features the Multi-Step Function, enabling efficient inspection of both tall (up to 40 mm) and short components during the same inspection. The TR7700QC SII supports current Smart Factory Standards, including the IPC-CFX and The Hermes Standard (IPC-HERMES-9852).
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.