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NVIDIA Blackwell Platform and ASIC Chip Upgrades to Boost Liquid Cooling Penetration to Over 20% in 2025,

09/23/2024 | TrendForce
TrendForce’s latest reports reveal that the launch of NVIDIA’s Blackwell platform, expected in 4Q24, is set to significantly drive the adoption of liquid cooling solutions. Liquid cooling penetration is projected to grow from around 10% in 2024 to over 20% in 2025.

Cadence Tensilica HiFi 5 DSPs Used in NXP’s Next-Gen Audio DSP Family

09/19/2024 | Cadence Design Systems
In a significant achievement for the automotive industry, Cadence's Tensilica HiFi 5 Digital Signal Processors (DSPs) are now a key component in NXP® Semiconductors' latest automotive audio DSP family, enabling advanced audio capabilities for next-generation software-defined vehicles.

Orbit International Reports Consolidated Bookings for Q1 2024

04/05/2024 | Globe Newswire
Orbit International Corp., an electronics manufacturer and software solution provider, announced that consolidated bookings for the first quarter of 2024 were approximately $12,700,000. Deliveries for these orders have already commenced and are expected to continue through the first quarter of 2026.

Cadence Expands Tensilica Vision Family with Radar Accelerator and New DSPs Optimized for Automotive Applications

03/04/2024 | Cadence Design Systems, Inc.
Cadence Design Systems, Inc. expanded its Tensilica IP portfolio to address the increasing computational requirements associated with automotive sensor fusion applications.

SAIC to Realign Organization to Optimize Strategic Pivots and Increase Organic Growth

12/12/2023 | BUSINESS WIRE
Science Applications International Corporation, a premier Fortune 500® technology integrator driving our nation's digital transformation across the defense, space, civilian and intelligence markets, announced it will reorganize its business, effective February 3, 2024.
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