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For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 7, 2024 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

It’s been a great week. I spent part of the week at PCB East, which was held at the Boxboro Regency in Boxboro, Massachusetts. I haven’t been to Boxboro in about 20 years. The last time I was at PCB East in Boxboro, design instructor Mary Sugden had a hot plate and a supply of bologna in her room, because she preferred fried bologna to anything she could get in a restaurant. Never a dull moment with PCB designers!
PCB East has been growing since it re-opened a few years ago. The conference was well attended, and Wednesday’s expo was busy all day long. These one-day tabletop shows are the way to go, as we’ve seen lately with the success of SMTA’s local shows. I’ll have a post-show write-up next week.
But I’m glad to be home. Here’s a roundup of this week’s top news as you head into the weekend.
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Published December 8
Technology Editor Happy Holden has been following the growing development of “bend-to-install” or “semi-flex” materials. In this update, Happy breaks down the details of this process, which, unlike flexible circuits, utilizes standard FR-4 materials and processes. We’re seeing a lot of “hybrid” processes like this now, and we’ll continue to follow this technology.
My Experience as an International Student
Published June 5
It must be really stressful being an international student; I had a hard enough time graduating from college in the country where I was born. But Palash Vyas is a little more of a go-getter than I was, to say the least. In this article, the recent doctoral graduate outlines his path from Mumbai to Auburn University, his volunteer efforts with IPC and SMTA, and winner of Best Poster Award at this year’s IPC APEX EXPO.
The Pulse: Overconstraining: Short, Slim, and Smooth
Published June 6
As columnist Martyn Gaudion says, small is beautiful in high-speed design and high reliability. To avoid overconstraining your high-speed board, Martyn explains why keeping things “short, slim, and smooth” are watchwords and why designers must take cost and DFM into account with each design.
Has It Really Been Survival Mode?
Published June 6
This is a topic that we’ve been hearing about for years: Companies in the EMS industry that are doing well have done so by being in “survival mode” for years. But is that really the case? Mark Wolfe examines this issue, starting with the four questions that each EMS manager answers before accepting every job.
Advancing PCB Technology: A Conversation With John Johnson
Published June 4
In this audio interview, John Johnson of American Standard Circuit discusses the industry’s continued movement toward finer lines and spaces and additive processes, as well as the need for a “mindset shift” and training in order to meet the needs of this new technology. He also discusses the need to focus on cleanliness and material adhesion with ultra-fine lines.
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Harnessing Connections: EWPTE 2025 Draws Nearly 3,000 Attendees
05/19/2025 | IPCThe 2025 Electrical Wire Processing Technology Expo (EWPTE), held May 6-8 at Baird Center in Milwaukee, Wis., provided 2,994 attendees the opportunity to meet, network and learn from the industry leading innovators and suppliers.
Zhen Ding Reported Its 1Q25 Results, with Revenue Hitting a Record High for the Same Period
05/16/2025 | Zhen Ding TechnologyZhen Ding Technology Holding Limited a global leading PCB manufacturer, today announced its consolidated financial results for the first quarter of 2025.
Interlink Electronics Reports Q1 2025 Result
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indie Semiconductor Reports Q1 2025 Results
05/13/2025 | BUSINESS WIREindie Semiconductor, Inc., an automotive solutions innovator, today announced first quarter results for the period ended March 31, 2025. Q1 revenue was up 3.3 percent year-over-year to $54.1 million with Non-GAAP gross margin of 49.5 percent. On a GAAP basis, first quarter 2025 operating loss was $38.9 million compared to $49.6 million a year ago.
Keytronic Announces Results for Q3 of Fiscal Year 2025
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