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Indium Corporation Introduces Cutting-Edge, High-Reliability Alloy for Solder Paste

06/14/2024 | Indium Corporation
Indium Corporation is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.

ASMPT Combines High-speed Chip Assembly Directly from the Wafer with SMT Placement in a Single Machine

06/06/2024 | ASMPT
As automotive applications, 5G and 6G, smart devices and many others require ever more compact and powerful components, advanced packaging becomes one of the key technologies.

Spirit Electronics Offers ISOCOM Limited Optoelectronics and Microelectronics through Authorized Distribution

06/05/2024 | BUSINESS WIRE
Spirit Electronics announces authorized distribution for ISOCOM Limited, an optoelectronics and microelectronics manufacturer serving aerospace and defense industries. ISOCOM products hold flight heritage in space and offer a range of solutions including hermetically packaged and radiation-hardened solutions for optocouplers, power MOSFETs, solid state relays, voltage regulators and more.

TTM Technologies Unveils New Xinger High-Performance 50W (AVG) Couplers

05/30/2024 | Globe Newswire
TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies and printed circuit boards (PCBs) has announced the launch of its 5mm x 3.2mm X-Band 8-12 GHz 3dB hybrid coupler and 20dB directional coupler.

Delvitech’s Cutting-Edge Technology Overcomes the Conventional Boundaries of Optical Inspection at SMT Connect

05/29/2024 | Delvitech
Not only does Delvitech offer an innovative solution aimed at revolutionizing automatic 3D optical inspection through seamless integration of artificial intelligence, but it stands out as the sole provider to deliver exceptional results in inspecting electronic components previously deemed challenging to assess.
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