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Murata Launches New Silicon Capacitor Production Line

10/11/2024 | SEL
Murata Manufacturing Ltd, a leading manufacturer of electronic components, modules, and devices, has broadened the scope of its Integrated Passive Solutions offering by opening a new production line at its site in Caen, France.

Knowles Extends Operating Life of Electronic Devices with New Arc Suppressor/Snubber Network Devices

08/08/2024 | PRNewswire
Knowles Corporation, a market leader and global provider of advanced micro-acoustic microphones and speakers, audio solutions, and high-performance capacitors and RF products, announced the QAS Series, a new line of RC-type Arc Suppressor/Snubber components that extend the operating life of electronic and electro-mechanical devices.

Green Circuits Unveils Innovative Stacked Capacitors Assembly Process

03/21/2024 | Green Circuits
Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, today announced a groundbreaking advancement in process engineering with the successful implementation of an innovative assembly technique for stacked capacitors.

Embedded Capacitors for PCBs, Chips, and Packages

02/26/2024 | Cody Stetzel, Cadence Design Systems
Package designers and chip designers assist the PCB layout engineer by including embedded capacitors on-chip and in-package to address the entire range of frequencies where decoupling is needed. As more electronics companies take a leading role in chip and package design, there is a need to determine the appropriate amount of capacitance needed to ensure low PDN impedance throughout broad frequency ranges. This article will look at the different types of capacitors that can be used as embedded components in PCBs and in chips/packages.

Beyond Design: Embedded Capacitance Material

02/22/2024 | Barry Olney -- Column: Beyond Design
Embedding components into the multilayer PCB substrate can have many benefits, including reduced board size and improved signal integrity. However, embedded capacitance material (which is not really a component but rather part of the substrate) can improve power integrity dramatically by reducing AC impedance and generally enhancing the performance of the product. It takes up no additional space, is easy to implement (because it is compatible with standard FR-4 processes), and can be cost-effective.
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