Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
American Made Advocacy: Where’s the Budget for a Modern Military Run on Microelectronics?
PCBAA Congratulates Cadenazzi on Assistant Secretary of War for Industrial Base Policy
September 19, 2025 | PCBAAEstimated reading time: Less than a minute
In a recent announcement to the industry, David Schild, executive director of The Printed Circuit Board Association of America, highlighted the recent appointment of MIchael Cadenazzi as Assistant Secretary of War for Industrial Base Policy.
"The Printed Circuit Board Association of America congratulates MIchael Cadenazzi on his confirmation as Assistant Secretary of War for Industrial Base Policy. He has a deep understanding of defense industrial base issues based on his years of leadership experience in the military, defense industrial base businesses, and global consulting. We look forward to working with Assistant Secretary Cadenazzi as we jointly build a stronger trusted and secure microelectronics supply chain serving our men and women in uniform," said Schild.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Armstrong Asia Signs MOU with Checkmate Capital Group to Explore Strategic Collaboration
09/15/2025 | GlobeNewswireArmstrong Asia, a leading Singapore-based manufacturer of flexible material solutions with 16 factories across 7 countries in Asia, has signed a Memorandum of Understanding (MOU) with Checkmate Capital Group, LLC (“Checkmate Capital”), a U.S.-based investment and advisory firm active in the Asia-Pacific and North American regions, focused on cross-border transactions in the life sciences, medical technology, and other industries.
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Jeh Aerospace Raises $11M to Boost Aircraft Supply Chain
08/12/2025 | I-Connect007 Editorial TeamJeh Aerospace, the high-precision aerospace and defense manufacturing startup founded by Vishal Sanghavi and Venkatesh Mudragalla, has raised $11 million in a Series A round led by Elevation Capital, with support from General Catalyst, to scale its commercial aircraft supply chain manufacturing in India, according to OEM.
LQDX Inc. Completes Sale of Aluminum Clad Laminate IP to Toyo Aluminium K.K.
07/31/2025 | PR NewswireLQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has completed the divestiture of its Aluminum Clad Laminate IP – known as ACL™ – to Toyo Aluminium K.K., a Japan-based global market leader in specialty aluminum-based products for the consumer, electronics and automotive sectors.
Clear Demand Signal Needed for CHIPS Success
08/01/2025 | I-Connect007 Editorial TeamIn July, the National Defense Industrial Association’s (NDIA) Electronics Division released a white paper titled "Clear Demand Signal Needed for CHIPS Success." The paper highlights the importance of the CHIPS and Science Act’s $52 billion investment in revitalizing secure domestic semiconductor production, but also raises the alarm that the Act mainly addresses supply challenges and has not established mechanisms to ensure ongoing demand for U.S.-based microelectronics production.