Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

Best Technical Paper Awards Showcased at APEX EXPO 2026

03/02/2026 | Global Electronics Association
The Global Electronics Association today announced the recipients of the Best Technical Paper Awards from the Advanced Electronic Packaging Conference at APEX EXPO 2026.

Marcy’s Musings: Looking Forward—APEX EXPO 2026 (and AI Design Tools Too)

02/18/2026 | Marcy LaRont -- Column: Marcy's Musings
This month, I-Connect007 Magazine previews APEX EXPO 2026, from exhibitors and special events on the show floor to new insights from the technical conference, details on keynotes, and advancements in critical industry standards. The show also has an international flavor, so we’ve included links to articles from Mexico, East Asia, and India. For PCB designers, we focused on AI in design tools, which turns out to be much more than the dreaded auto-router. We've got articles from Zuken, Siemens, and AllSpice.io.

Changing the Electronics Systems Conversation

02/16/2026 | Nolan Johnson, SMT007 Magazine
Rebranding as the Global Electronics Association is not the only major change happening at APEX EXPO this year. There’s also a shift in the scope of the technical program as heterogenous integration and other advanced packaging methodologies come into the mainstream at both the component and system levels. We spoke with Matt Kelly, CTO and conference general chair, Devan Iyer, chief strategist for advanced electronic packaging, and Stan Rak and Udo Welzel, now in their fourth year as chairs of the Technical Program Committee, about what distinguishes the conference this year.

February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging

02/11/2026 | I-Connect007 Editorial Team
I-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging. As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.

PEDC: Built for the Design Community by the Design Community

02/05/2026 | Peter Tranitz, Global Electronics Association
The Pan-European Electronics Design Conference (PEDC) was developed to provide Europe’s electronics design community with a non-commercial, Pan-European, technologically advanced forum. PEDC 2026 delivered exactly that. This second edition of the conference brought together 130 participants from 23 countries across Europe and beyond for two days of technical exchange, discussion, and connection. Hosted by the Global Electronics Association and Fachverband Elektroniksdesign und-fertigung e.V. (F.E.D)., and supported by Altium, Siemens, and Zuken, the event featured three technical tracks, 36 presentations, three keynotes, and a group of exhibitors.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in