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BAE Systems, GlobalFoundries Collaborate to Strengthen Supply of Essential Semiconductors for National Security Programs

06/24/2024 | BAE Systems
BAE Systems and GlobalFoundries announced a new collaboration to strengthen the supply of critical semiconductors for national security programs.

Ansys to Demonstrate 3D Multiphysics Visualization of Electromagnetic and Thermal Effects in Semiconductor Packages at Design Automation Conference

06/20/2024 | ANSYS
Ansys announced that it is adopting NVIDIA Omniverse application programming interfaces (APIs) to offer 3D-IC designers valuable insights from Ansys’ physics solver results through real-time visualization. Ansys announced that it is adopting NVIDIA Omniverse application programming interfaces (APIs) to offer 3D-IC designers valuable insights from Ansys’ physics solver results through real-time visualization.

American Made Advocacy: Changing Leadership and Three Years of Advocacy in D.C.

06/18/2024 | Travis Kelly -- Column: American Made Advocacy
This month, my term as chair of PCBAA ended, and I turned over those responsibilities to Shane Whiteside, CEO of Summit Interconnect. It has been my honor to serve as chair. From the beginning, when we had only five founding members, to more than 60 today, we have representation from companies and individuals in manufacturing, assembly, and materials. I look forward to working with Shane in his new role and know that PCBAA will benefit from his many years of leadership experience.

SEMI Applauds New Legislative Solution to Address Gap in U.S. Chips Act Notice of Funding Opportunity

06/17/2024 | SEMI
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, issued the following statement from Joe Stockunas, President of SEMI Americas. Stockunas commends a proposed legislative action by the United States government to address the Notice of Funding Opportunity for CHIPS and Science Act support for the construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the U.S.:

Rocket Lab Signs Preliminary Terms to Receive up to $23.9M in Funding Under the CHIPS Act to Expand Production of Semiconductors that Power Spacecraft

06/11/2024 | BUSINESS WIRE
Rocket Lab USA, Inc., a global leader in launch services and space systems, today announced the signing of a non-binding preliminary memorandum of terms (PMT) with the Department of Commerce that would see Rocket Lab receive up to $23.9M in direct funding under the CHIPS and Science Act.
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