Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
OE-A at ICFPE 2024, Taipei, Taiwan
June 11, 2024 | OE-AEstimated reading time: Less than a minute
The International Conference on Flexible and Printed Electronics (ICFPE 2024) takes place from August 28-30, 2024, in Taipei, Taiwan. OE-A is a partner of this event and organizes a conference session. The OE-A Asia Meeting will be held one day prior to the ICFPE in Taipei, August 27.
The conference ICFPE is hosted by the National Taipei University of Technology. As a partner of ICFPE, OE-A is organizing a conference session on ‘Flexible and Printed Electronics’. The OE-A session will address a variety of aspects and applications of flexible and printed electronics, such as Artificial Intelligence for Printing, Display Technology, Printing Process and Equipment, Flexible Electronic Materials and Green Energy – just to give a few examples. Dr. Alain Schumacher, CTO of IEE and Vice Chair OE-A, gives a keynote at the conference.
Share on:
Suggested Items
EIPC Summer Conference 2025: PCB Innovation in Edinburgh
04/18/2025 | EIPCEIPC have very wisely selected this wonderful city in Scotland as the venue for their Summer Conference on June 3-4. Whilst delegates will be distilling the proven information imparted by the speakers in the day, in the evening they will be free spirits at the Conference Dinner.
ASMC 2025 Showcases AI and Emerging Technologies Shaping the Future of Semiconductor Manufacturing
04/16/2025 | SEMIThe 36th annual Advanced Semiconductor Manufacturing Conference (ASMC) 2025 will be held May 5-8, 2025, in Albany, New York, bringing together leaders in semiconductor manufacturing to explore cutting-edge advancements driving high-volume production and AI-powered innovation.
ASMC 2025 Showcases AI and Emerging Technologies Shaping the Future of Semiconductor Manufacturing
04/15/2025 | SEMIThe 36th annual Advanced Semiconductor Manufacturing Conference (ASMC) 2025 will be held May 5-8, 2025, in Albany, New York, bringing together leaders in semiconductor manufacturing to explore cutting-edge advancements driving high-volume production and AI-powered innovation.
Electronics Industry Reimagines the Possibilities at IPC APEX EXPO 2025
04/07/2025 | IPCThe electronics industry is driven by innovators and problem-solvers, and IPC APEX EXPO 2025 provided endless opportunities to connect, collaborate, and shape the future.
EIPC Summer Conference 2025: Call for Distinguished Speakers in Edinburgh
03/26/2025 | EIPCThe European Institute of Printed Circuits (EIPC) is pleased to announce its Summer Conference 2025, scheduled for June 3-4 in the historic city of Edinburgh, Scotland.