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Siemens Introduces Innovator3D IC - a Comprehensive Multiphysics Cockpit for 3D IC Design, Verification and Manufacturing

06/24/2024 | Siemens
Siemens Digital Industries Software announced today Innovator3D IC, new software that delivers a fast, predictable path for the planning and heterogeneous integration of ASICs and chiplets using the latest and most advanced semiconductor packaging 2.5D & 3D technologies and substrates in the world.

iTAC, Partners are Enablers for the Battery Factory of the Future

05/29/2024 | iTAC Software AG
In Europe, there was no supplier that could provide the complete system technology for the production of vehicle batteries from a single source. Dürr, iTAC and other partners have changed that.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week 

06/21/2024 | Marcy LaRont, PCB007 Magazine
He’s back, and in splendid form. Pete’s Starkey’s coverage of the EIPC Summer Conference, which took place June 4-5 at the European Space Centre, The Netherlands, is top notch. Joan Tourné from NextGIn Technologies emphasized that our attention must be focused on the interconnection ability of our PCBs and highlights VeCS as an alternative to the traditional plated-through-hole approach. Finally, Martyn Cauwe of IMEC discusses environmental impact and specifically, the need for a better, parametric approach to quantifying it, something European businesses are being required to do on the regular.

Foxconn Expands into New Energy with Strategic JV and Launches New Charging Solutions

06/21/2024 | Foxconn
Foxconn Interconnect Technology, a subsidiary of Hon Hai, is expanding its presence in the electric vehicle (EV) sector.

Renesas Completes Acquisition of Transphorm

06/21/2024 | BUSINESS WIRE
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it has completed the acquisition of Transphorm, Inc., a global leader in gallium nitride (GaN) power semiconductors, as of June 20, 2024.
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