Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect

05/30/2025 | iNEMI
One of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.

E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation

05/30/2025 | E-tronix
E-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.

INEMI Smart Manufacturing Tech Topic Series: Enhancing Yield and Quality with Explainable AI

05/02/2025 | iNEMI
In semiconductor manufacturing, the ability to analyze vast amounts of high-dimensional data is critical for ensuring product quality and optimizing wafer yield.

INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b

04/28/2025 | iNEMI
In 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.

Real Time with... IPC APEX EXPO 2025: Aster—Enhancing Design for Effective Testing Strategies

04/18/2025 | Real Time with...IPC APEX EXPO
Will Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in