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INEMI Smart Manufacturing Tech Topic Series: Enhancing Yield and Quality with Explainable AI

05/02/2025 | iNEMI
In semiconductor manufacturing, the ability to analyze vast amounts of high-dimensional data is critical for ensuring product quality and optimizing wafer yield.

INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b

04/28/2025 | iNEMI
In 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.

Real Time with... IPC APEX EXPO 2025: Aster—Enhancing Design for Effective Testing Strategies

04/18/2025 | Real Time with...IPC APEX EXPO
Will Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.

INEMI Sustainable Electronics Tech Topic Webinar: Enabling New Life in Storage Devices

04/17/2025 | iNEMI
Hard disk drives (HDDs) and solid state drives (SSDs) are ubiquitous in electronic products and a large number enter the end-of-life stream prior to their true end of life.

KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies

04/16/2025 | KOKI
KOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.
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