Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
The Chemical Connection: Through-glass Vias in Glass Substrates
Global Leader Implements Ucamco's Jayda Software: Revolutionizing Online PCB Procurement
June 12, 2024 | UcamcoEstimated reading time: 1 minute
Ucamco proudly announces that a global leader has implemented Ucamco’s groundbreaking Jayda software in its new web shop. This strategic collaboration represents a significant leap forward in redefining the landscape of online PCB procurement, leveraging Jayda's capabilities to streamline and revolutionize the industry.
What is Jayda?
Ucamco’s Jayda is a highly responsive and ultra-fast data input and analysis sales tool designed to empower online web portals and quotation engines. Leveraging state-of-the-art technology, Jayda communicates seamlessly with web servers, extracting key PCB characteristics from visitor archives and safely storing them for accurate price calculation. Its progressive result gathering feature ensures a smooth user experience, eliminating endless back-and-forth communications with customers. Jayda's best-in-class stack-up engine offers unsurpassed first-pass hit rates at record speed, empowering businesses to deliver timely and precise quotations, thus achieving a significantly higher quote-to-order conversion.
Huge benefits
Integrated into the web shop of this global leader, Jayda enhances the user experience by providing instant quotes. With over 25 years of experience in the electronic industry, our customer understands the importance of efficiency and quality in PCB procurement. Jayda’s automatic Gerber data extractor represents a significant improvement over previous systems, meeting customer demands and simplifying the ordering process, getting users their quotes in less than 5 minutes.
Share on:
Suggested Items
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
INEMI Smart Manufacturing Tech Topic Series: Enhancing Yield and Quality with Explainable AI
05/02/2025 | iNEMIIn semiconductor manufacturing, the ability to analyze vast amounts of high-dimensional data is critical for ensuring product quality and optimizing wafer yield.
INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b
04/28/2025 | iNEMIIn 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.
Real Time with... IPC APEX EXPO 2025: Aster—Enhancing Design for Effective Testing Strategies
04/18/2025 | Real Time with...IPC APEX EXPOWill Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.