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LPMS USA, a leader in low-pressure molding solutions, is proud to have partnered with Bostik to host a live technical webinar focused on electronic encapsulation using low-pressure molding and the launch of Bostik’s newest outdoor grade material, Thermelt® 964.
The live webinar will take place on Wednesday, February 11, 2026, from 10:00 a.m. to 11:00 a.m. Central and will feature technical experts from both organizations. The session will explore how low pressure molding delivers reliable protection for sensitive electronics and how Thermelt® 964 expands performance possibilities for outdoor and demanding environments.
During the webinar, attendees will gain insight into:
- How low pressure molding compares to other electronic encapsulation methods
- The value and performance advantages of Thermelt low pressure molding resins
- How Thermelt® 964 stands out in the market and helps manufacturers meet demanding performance requirements with greater confidence
As a featured guest speaker, Brian Betti, President of LPMS USA, will share:
- The value of LPMS low pressure molding equipment platforms
- How and why to implement Thermelt® 964 in production environments
- A real-world success case demonstrating Thermelt® 964 in use
Webinar presenters include:
- Christos Karadimas, Engineering Adhesives Regional Director, Bostik
- Sarah Dupe, Senior Engineer Durable Goods, Bostik
- Brian Betti, President, LPMS USA
Register today on Bostik's website to reserve your spot.
