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Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
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eCADSTAR Sets New Standards for Compact PCB Design with Etched Inductor Parts
June 12, 2024 | ZukenEstimated reading time: 1 minute

Zuken announces the 2024 release of eCADSTAR, Zuken’s next-generation PCB design system for small and medium businesses. The new release includes a number of improvements ranging from enhanced design reuse, simplified revision tracking and more robust schematic design.
eCADSTAR 2024 supports PCB designers in meeting the increasing demand for compact, high-performance, energy-efficient, and environmentally friendly electronic devices. Addressing the challenge of limited PCB space, the 2024 release optimizes the placement of etched resistors on inner layers, essential for the termination of critica signals. The intuitive footprint editor allows for easy customization of size and shape, ensuring accurate resistance values and enhancing design efficiency.
Design Comparison Capability for Revision Tracking
The new release introduces a comprehensive design comparison capability that allows designers to easily identify differences between two PCB or schematic designs. This feature is invaluable for understanding revisions made over time, especially when the documentation of
changes is deficient. In addition, the shape comparison tool aids in reverse engineering efforts by highlighting discrepancies in copper and routing patterns.
Efficient Component Transfer
The new "Copy Complete Part" feature allows designers to effortlessly transfer a component, along with its comprehensive set of data including PCB footprint, schematic symbol, padstacks, and 3D model, from a customer-specific or prototype library to a central library directly to a customer-specific library in a single action. This capability not only saves valuable time, but also ensures consistency and accuracy in the design process - a significant improvement over the piece-by-piece transfer processes of the past.
Schematic Updates for Improved Design Experience
eCADSTAR Schematic has received several updates to improve the design experience. The documentation enhancements now include support for variant text. The drawing of nets and buses has been optimized to make the process of connecting components much easier. In addition, the introduction of new Design Rule Checks (DRCs) helps identify potential problems early on, streamlining the design process, reducing overall design time, and minimizing the need for later revisions.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
SMT007 Magazine July—What’s Your Competitive Sweet Spot?
07/01/2025 | I-Connect007 Editorial TeamAre you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche—what are their insights? In the July 2025 issue of SMT007 Magazine, we spotlight companies thriving by redefining or reinforcing their niche and offer insights to help you evaluate your own.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.