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Indium Corporation Introduces Au-Based Precision Die-Attach Preforms

07/17/2024 | Indium Corporation
Indium Corporation® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of precision to reduce defects, control bondline thickness (BLT), and deliver high-yield performance and reliability in critical die-attach applications.

Indium Corporation’s New Type 6 Jetting Solder Paste Hits Market

06/26/2024 | Indium Corporation
Indium Corporation® is pleased to introduce a new jetting solder paste to join its PicoShot® series of products. PicoShot® NC-6M is a no-clean, halogen-free, Type 6 powder-size material specifically formulated to be compatible with Mycronic jetting systems and Mycronic’s “small dot” ejector.

Indium Corporation Introduces Cutting-Edge, High-Reliability Alloy for Solder Paste

06/14/2024 | Indium Corporation
Indium Corporation is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.

Werner H. J. Wagner Appointed as General Manager of Indium Corporation Advanced Materials GmbH

06/11/2024 | Indium Corporation
Indium Corporation, a leading innovator in industrial material solutions, is thrilled to announce the appointment of Werner H. J. Wagner as its new General Manager.

Indium Corporation to Showcase Sustainable Solutions for Power Electronics at PCIM

05/17/2024 | Indium Corporation
As one of the leading materials providers to the power electronics assembly industry, Indium Corporation® will proudly showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany.
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