Global Sourcing Spotlight: Tariffs—The New Reality
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
IPC Hosts Advanced Packaging Symposium in Tokyo
June 13, 2024 | IPCEstimated reading time: 1 minute
The IPC Advanced Packaging Symposium held in Tokyo on June 7, 2024, brought together leading experts, policy makers and other stakeholders from the semiconductor industry to discuss cutting-edge advancements and collaborative strategies shaping the future of advanced packaging technologies.
Under the guidance of Matt Kelly, IPC chief technology officer and vice president of technology solutions, the symposium commenced with an opening address from John W. Mitchell, IPC president and CEO and Hiroyuki Watanabe, IPC Board member and executive director of global security strategic planning at NEC Corporation.
Highlights of the event included presentations from esteemed speakers including Hidemichi Shimizu, director of device industry and semiconductor strategy at Ministry of Economy, Trade and Industry (METI), who delved into Japan’s strategic initiatives for advanced packaging, emphasizing the country's pivotal role in driving innovation in the semiconductor landscape.
Raja Swaminathan, corporate vice president of advanced packaging at AMD, educated participants with insights into the future of AI hardware enabled by advanced packaging, sparking engaging discussions on how the Japanese ecosystem can spearhead this transformative drive.
Matt Kelly's presentation on IPC’s advanced packaging initiative shed light on the organization's efforts to facilitate collaboration and standardization within the industry, fostering a conducive environment for technological advancements and market growth.
"The industry stands on the brink of a new era in advanced packaging, driven by innovation and collaboration. IPC extends its heartfelt thanks to all the guests who participated in the symposium. IPC remains dedicated to supporting advanced packaging through its standards, education, advocacy efforts, providing platforms for experts to exchange ideas, share knowledge, and shape the future of advanced packaging technology,” remarked Kelly.
To learn more about IPC’s advanced packaging initiative, visit www.ipc.org/solutions/ipc-advanced-packaging-technology.
Share on:
Suggested Items
ITEN, A*STAR IME Announce Breakthrough in Solid-State Battery Integration for Advanced Packaging
05/15/2025 | BUSINESS WIREITEN, a global leader in micro solid-state batteries, and A*STAR Institute of Microelectronics (A*STAR IME), a leader in advanced packaging research, have announced a groundbreaking achievement for the integration of ITEN’s micro batteries using A*STAR IME’s cutting-edge advanced packaging platform.
ASMPT Presents Die Bonder with Intelligent Features
05/14/2025 | ASMPTASMPT, the leading supplier of production equipment for advanced packaging and semiconductor assembly, introduces its flagship INFINITE bonder, which achieves top performance in throughput and quality.
Top 10 OSAT Companies of 2024 Revealed—China Players See Double-Digit Growth, Reshaping the Global Market Landscape
05/13/2025 | TrendForceTrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation.
BEST Inc. Offers Complete Portfolio of Electronic Component Salvaging Services
05/12/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they offer a complete range of electronic component salvaging services. With more than 20 years of BGA salvaging experience, BEST has the knowledge, skills, and proper equipment to reliably remove and prepare components for later use in the assembly of printed circuit boards.
Koh Young Invites You to the 2025 IEEE Electronic Components and Technology Conference
05/06/2025 | Koh YoungKoh Young, the industry leader in True3D™ measurement-based inspection solutions, invites you to join us at the 2025 IEEE Electronic Components and Technology Conference (ECTC), taking place May 27–30, 2025, at the Gaylord Texan Resort & Convention Center in Grapevine, Texas