-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Summit Interconnect Appoints David Lane as New General Manager and VP of Denver-based Advanced Assembly
June 13, 2024 | Summit Interconnect, Inc.Estimated reading time: 1 minute

Summit Interconnect, a leading provider of advanced PCB manufacturing, today announced that David Lane recently joined the company as General Manager and Vice President. In this position, he oversees all aspects of operations within Summit’s Denver-based facility, Advanced Assembly.
Lane is an industry veteran with over 25 years of hands-on experience in operations and management. He joins Summit Interconnect after serving as the Director of Global Key Accounts at Universal Instruments Corporation, where he played a pivotal role in driving business growth and enhancing customer relationships. Before that, he held key executive positions at Creation Technologies, NEO Technology Solutions (OnCore Manufacturing, LLC.), DDi (Dynamic Details, Inc), McData Corporation, and Compaq Computers.
“We are thrilled to welcome David Lane to Summit Interconnect as the new General Manager of our assembly division,” said Sean Patterson, COO of Summit Interconnect. “David’s extensive experience and proven leadership will be invaluable assets as we expand our capabilities and continue delivering superior products and services to our customers.”
Throughout his career, David has demonstrated exceptional skills in operations management, business strategy, customer relationship management (CRM), and team leadership. He has a long history of building and leading technical organizations, manufacturing operations teams, and cross-functional teams focused on delivering innovative solutions and driving continuous improvement initiatives.
“I am excited to join Summit Interconnect and lead the assembly team,” said David Lane. “I look forward to collaborating with the talented individuals at Summit Interconnect and leveraging our collective expertise to drive innovation, exceed customer expectations, and achieve operational excellence.”
Lane holds a B.S. in Mechanical Engineering from Colorado State University.
Advanced Assembly, a Summit Interconnect company, will change its name to Summit Interconnect Assembly later this year.
Suggested Items
Summit Interconnect Announces Key Executive Appointments: Sean Patterson Named CTO, Michael Norman Joins as President and COO
03/06/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading provider of advanced PCB manufacturing solutions, is pleased to announce two key leadership updates to its executive team.
Summit Interconnect Welcomes Leo LaCroix as Vice President of Aerospace & Defense Operations
02/21/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading provider of advanced printed circuit board (PCB) solutions, is pleased to announce that Leo LaCroix has joined the company as Vice President of Aerospace & Defense Operations. In this role, LaCroix will oversee operational strategy, customer engagement, and manufacturing excellence for Summit’s aerospace and defense-focused facilities, driving continued growth and innovation in the sector.
I-Connect007 Welcomes New Milaero Columnist Jesse Vaughan
02/18/2025 | I-Connect007 Editorial TeamI-Connect007 is excited to announce the addition of a new monthly column, “Beyond the Board,” authored by Jesse Vaughan, a seasoned expert in the PCB/milaero sector. Jesse, a third-generation printed circuit board technologist currently working at Summit Interconnect, brings a wealth of knowledge and passion to our publications.
Technica Installs CBT/MLI Direct Imaging System at Summit Interconnect Santa Clara
01/14/2025 | Technica USATechnica has recently installed the 6th CBT/MLI Direct Imaging (DI) system at Summit Interconnect's Santa Clara operation, a testament to Summit's ongoing commitment to cutting-edge technology and operational excellence.
Scanfil Suzhou Factory Receives Sustainability Award from Thermo Fisher Scientific
12/16/2024 | ScanfilThermo Fisher Scientific granted a Sustainability Award to Scanfil’s Suzhou factory at the APAC Sustainability Summit. This accolade highlights Suzhou’s dedication to sustainable practices.