Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
Summit Interconnect Appoints David Lane as New General Manager and VP of Denver-based Advanced Assembly
June 13, 2024 | Summit Interconnect, Inc.Estimated reading time: 1 minute
Summit Interconnect, a leading provider of advanced PCB manufacturing, today announced that David Lane recently joined the company as General Manager and Vice President. In this position, he oversees all aspects of operations within Summit’s Denver-based facility, Advanced Assembly.
Lane is an industry veteran with over 25 years of hands-on experience in operations and management. He joins Summit Interconnect after serving as the Director of Global Key Accounts at Universal Instruments Corporation, where he played a pivotal role in driving business growth and enhancing customer relationships. Before that, he held key executive positions at Creation Technologies, NEO Technology Solutions (OnCore Manufacturing, LLC.), DDi (Dynamic Details, Inc), McData Corporation, and Compaq Computers.
“We are thrilled to welcome David Lane to Summit Interconnect as the new General Manager of our assembly division,” said Sean Patterson, COO of Summit Interconnect. “David’s extensive experience and proven leadership will be invaluable assets as we expand our capabilities and continue delivering superior products and services to our customers.”
Throughout his career, David has demonstrated exceptional skills in operations management, business strategy, customer relationship management (CRM), and team leadership. He has a long history of building and leading technical organizations, manufacturing operations teams, and cross-functional teams focused on delivering innovative solutions and driving continuous improvement initiatives.
“I am excited to join Summit Interconnect and lead the assembly team,” said David Lane. “I look forward to collaborating with the talented individuals at Summit Interconnect and leveraging our collective expertise to drive innovation, exceed customer expectations, and achieve operational excellence.”
Lane holds a B.S. in Mechanical Engineering from Colorado State University.
Advanced Assembly, a Summit Interconnect company, will change its name to Summit Interconnect Assembly later this year.
Share on:
Suggested Items
SEMICON Europa 2024 Opens Tomorrow to Highlight Innovation and Collaboration Powering Sustainable Growth
11/11/2024 | SEMISEMICON Europa 2024 opens tomorrow at Messe München in Munich, Germany, convening industry leaders from across the electronics design and manufacturing supply chain to exchange insights on the advancements and trends driving sustainable growth in the semiconductor sector.
CACI Completes Acquisition of Azure Summit Technology
10/31/2024 | BUSINESS WIRECACI International Inc. announced that it has completed its acquisition of Azure Summit Technology, a provider of innovative, high-performance radio frequency (RF) technology and engineering, focused on electromagnetic spectrum, in an all-cash transaction for $1.275 billion.
Real Time with... SMTAI 2024: Summit Interconnect Doing Its Part to Rebuild Industry Expertise
10/29/2024 | Real Time with...SMTAIIn this interview from the recent SMTAI show, Nolan Johnson speaks with Jesse Vaughan from Summit Interconnect. Jesse hits the highlights for some of Summit's programs to promote skilled workers in our industry—programs such as apprenticeships, Emerging Engineers, and more.
SEMICON Japan 2024 to Expand Scope with Spotlight on Advanced Design Innovation
10/23/2024 | SEMISEMICON Japan 2024, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will assemble more than 1,000 exhibitors showcasing semiconductor solutions for smart technologies from Dec. 11-13 at Tokyo Big Sight.
FIT Hon Teng Showcases AI Data Center Connectivity and Immersion-Cooled Signal Integrity Solutions at OCP Global Summit 2024
10/21/2024 | FoxconnFIT Hon Teng, a subsidiary of Hon Hai Precision Industry, will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit.