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Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
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IPC Masters 2024 Aims to Enhance Operator Skills in China
June 14, 2024 | IPCEstimated reading time: Less than a minute
To meet the needs of China's electronics industry, IPC Asia and Pudong New Area Association For Quality And Technology Shanghai, will jointly organize a comprehensive skill competition event, IPC Masters 2024, 9:30 a.m. July 8, to 5 p.m. July 10 (CDT), in Shanghai, China. IPC Masters will include Hand Soldering Competition (HSC), Cable and Wire Harness Assembly Competition (CWAC), BGA/BTC (Ball Grid Array/Bottom Termination Components) Rework Competition and IPC Standard Knowledge Competition.
IPC Masters aims to provide a valuable platform for operators in the electronic industry across China to enhance their skills and showcase their talents. Through this competition, contestants will have the opportunity to learn and apply their skills, contributing to the promotion of quality and technical standards in China's electronics manufacturing industry. The event also plays a pivotal role in talent development, enabling participants to step onto the international stage and demonstrate the strength and charm of China's skilled craftsmen
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