Technology Days 2024 at Rehm: #opentochange
June 14, 2024 | Rehm Thermal SystemsEstimated reading time: 2 minutes
“The only constant is change” – this is particularly true in electronics manufacturing. In an industry that is constantly evolving and changing, it is crucial to be open to change. Under the motto “#opentochange”, participants at the Technology Days 2024 on 11 and 12 September can expect current topics that are essential for success in modern industry and interesting ideas on the path to transformation.
Traditionally, inspiring presentations, interactive workshops and networking opportunities on the latest developments, trends and best practices in electronics manufacturing are at the centre of Rehm Thermal Systems' Technology Days. This year, a total of ten specialist presentations by in-house and invited experts will explore the challenges and opportunities associated with automation, digitalisation and the use of AI in production. The keynote speakers will be Professor Dr Dennis-Kenji Kipker from the cyberintelligence.institute and Professor Dr Isabell Welpe from the Technical University of Munich, who will talk about cyber security in production and the transformation of the world of work. Numerous workshops and live demonstrations will combine theory with current practical applications.
11 Sept. and 12 Sept. 2024 / 02:00 – 04:30 PM CEST
Workshop 1: From raw material to fuel: insight into the fuel production line
For some years now, hydrogen has been seen as a beacon of hope for the energy and climate transition: In industry, hydrogen can be produced in conjunction with electrolyzers, stored temporarily and used again as required in fuel cell units. Thermal systems are used for drying processes in the production of individual components for fuel cells. Find out which drying processes are possible for the individual components of the fuel cell with solutions from Rehm Thermal Systems.
11 Sept. and 12 Sept. 2024 / 02:00 – 04:30 PM CEST
Workshop 2: Effective coating and dispensing lines: Balancing costs and quality
In order to guarantee their functionality, printed circuit boards that are, for example, used in vital technical end products in the automotive industry, aviation or medical technology must be protected from aggressive environmental influences such as moisture, corrosion or dust: Discover the diverse possibilities and areas of application of our portfolio in the areas of conformal coating and dispensing. Our systems have numerous features that simplify the coating and dispensing process and ensure quality.
11 Sept. and 12 Sept. 2024 / 02:00 – 04:30 PM CEST
Workshop 3: Innovative condensation soldering processes with and without vacuum
In condensation reflow soldering, soldering is accomplished using a hot vapor. Thanks to the high heat transfer, large or high-mass boards can be easily processed in a stable process environment. The inert heat transfer medium used is perfluoropolyether (Galden®). The main topics are condensation soldering with and without vacuum as well as application areas and possibilities for integration into the existing production environment.
11 Sept. and 12 Sept. 2024 / 02:00 – 04:30 PM CEST
Workshop 4: Sustainable electronics production: Energy efficiency and resource conservation in SMD production
The tense situation regarding the availability of resources such as electrical energy and nitrogen sets new goals and challenges for both plant technology and the process definition of soldering. In this workshop, we will provide an overview of the plant- and process-specific possibilities of the new generation of systems for reducing resource consumption.
The Technology Days 2024 will take place on Wednesday, 11 September and Thursday, 12 September 2024 at the headquarters of Rehm Thermal Systems in Blaubeuren. A special highlight on the programme is the evening event in the Oldtimerfabrik Classic, an event location with a distinctive character and special charm.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.