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Don’t Just Survive, Thrive: The July 2024 Issue PCB007 Magazine

07/18/2024 | I-Connect007 Editorial Team
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. What does it take to remain viable and grow and prosper during so much change? In this issue of PCB007 Magazine, our contributors explore these concepts meant to help you take your business to the next level.

Squirro Acquires Synaptica: A Strategic Fusion of Generative AI and Knowledge Graph Technologies

07/16/2024 | BUSINESS WIRE
Squirro, a leading Swiss-headquartered global SaaS platform specializing in enterprise-ready generative AI, search, and business insights, proudly announces its acquisition of Synaptica, a renowned US-based SaaS provider of enterprise taxonomy management and knowledge graph systems.

Halo Industries Closes $80 Million Series B Funding Round Led by Thomas Tull’s U.S. Innovative Technology Fund

07/16/2024 | BUSINESS WIRE
Halo Industries, Inc., the creator of a laser manufacturing technology platform for the semiconductor industry, announced it raised up to $80 million in its oversubscribed Series B funding round. Led by Thomas Tull’s U.S. Innovative Technology Fund (USIT) with participation from 8VC and SAIC, the funding will help Halo Industries scale the commercialization and reach of its technology and advance its mission to establish the new gold-standard of silicon carbide substrate production.

NEC Technology Reliably Measures Sea Levels from a Greater Distance

07/16/2024 | JCN Newswire
NEC Corporation has developed a technology for measuring sea levels with high accuracy from greater distances using 3D Light Detection And Ranging (LiDAR), a remote sensing technology.

iNEMI Packaging Tech Topic Series: Damage-Free Rapid Electron Beam Testing for Advanced Packaging

07/16/2024 | iNEMI
Testing issues are limiting chip makers’ ability to create larger SOCs (system-on-chip). The scan field dimensions of EUV (extreme ultraviolet light) and NA (numerical aperture) EUV, which are typically used for testing, are too small. To enable larger chips, manufacturers are migrating to system-on-a-package (SOP).
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