TopLine Introduces Braided Columns as Drop-in Replacement for BGA Solder Balls
June 17, 2024 | TopLineEstimated reading time: 1 minute
TopLine Corporation announces the introduction of braided solder columns as a drop-in replacement for solder spheres used in Ball Grid Array (BGA) components. “Traditional Ball Grid Array (BGA) spheres have a history of failing in large sized BGA packages due to thermal stress and CTE mismatch,” TopLine CEO Martin Hart states.
Recognizing this weakness, TopLine has developed a family of Braided Solder Columns especially suited for cryogenic environments and next generation applications, replacing solder balls on IC packages of varying sizes. These columns provide improved reliability and thermal properties over competing technologies. Solder balls and heritage copper wrapped solder columns are not equal to the task. Hart already holds multiple patents in the field of column grid arrays.
This new generation of non-collapsible, RoHS compliant Lead-Free Copper Braided Solder Columns are designed to absorb destructive strain caused by differences in the Coefficient of Thermal Expansion (CTE) of materials between large sized heterogeneous 2.5D packages and FR4 printed circuit boards (PCB). This novel solder column technology is intended to replace solder balls typically found on ball grid array (BGA) packages as literally a drop-in replacement.
These next generation non-collapsible lead-free copper braided solder columns absorb destructive strain (stress) caused by differences in CTE between the chip package and the PCB. Its cylindrical shape and mechanical compliancy enable solder columns to support large packages, analogous to the way palm trees flex on a windy day without breaking. “With the industry trending to design larger and larger heterogeneous 2.5D BGA packages to meet the massive processing needs of AI and data centers,” Hart says, “BGA packages have an increasing potential for solder balls to crack and delaminate, resulting in catastrophic failure of the system. These new columns can prevent that stress-induced damage.”
Suggested Items
Real Time with... IPC APEX EXPO 2025: New Dispensing and Coating Solutions from Rehm
04/03/2025 | Real Time with...IPC APEX EXPOMichael Hanke, Global Sales Officer at Rehm, discusses new dispensing and coating equipment developed in Germany. He emphasizes the significance of software integration with customer systems to tackle market challenges.
BEST Inc. Presents StencilQuik for Simplifying BGA Rework Challenges
04/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and rework tools is thrilled to announce StencilQuik™ rework stencils. This innovative product is specifically designed for placing Ball Grid Arrays (BGAs) or Chip Scale Packages (CSPs) during the rework process.
Real Time with... IPC APEX EXPO 2025: Nordson's Expansion of Intelligent Technologies
04/02/2025 | Real Time with...IPC APEX EXPOJonathia Ang-Mueller gives an update on Nordson's latest selective soldering system which features a small footprint, offering cost savings and increased production capacity. Advanced software allows for pre-sales simulations, enhancing customer engagement.
Knocking Down the Bone Pile: Basics of Component Lead Tinning
04/02/2025 | Nash Bell -- Column: Knocking Down the Bone PileThe component lead tinning process serves several critical functions, including removing gold plating, mitigation of tin whiskers, reconditioning of component solderability issues, and alloy conversion from lead-free (Pb-free) to tin-lead or from tin-lead to lead-free for RoHS compliance. We will cover each of these topics in more detail in upcoming columns.
Real Time with... IPC APEX EXPO 2025: Innovations at Indium Corporation—A Look into the Future
04/02/2025 | Real Time with...IPC APEX EXPOIndium Corporation, led by CEO Ross Berntson, is making strides in automotive applications with innovative solder paste technologies. The company prioritizes sustainability and energy efficiency in manufacturing while developing its workforce through partnerships with local universities.