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Electronics Industry Sentiment Falls in June, Driven by Weaker Demand and Stronger Cost Pressures

07/03/2024 | IPC
Sentiment among electronics manufacturers fell in June; despite the decline, sentiment remains above its long-term average according to IPC’s June Sentiment of the Global Electronics Manufacturing Supply Chain Report.

Don’t Overconstrain Your Board Materials

07/02/2024 | I-Connect007 Editorial Team
When we started planning May’s issue, which centers on the use of traditional laminates in certain high-frequency PCBs, we knew we had to interview Kris Moyer and Ed Kelley together. Kris teaches advanced PCB design classes for IPC, and Ed is the former CTO of Isola and founder of Four Peaks Innovation. What ensued was a wide-ranging discussion on the evolution of “standard” PCB laminates and the recent trend by some OEMs to use these materials in high-frequency and even RF boards.

SEMI Applauds U.S. Chips Act Award For Entegris Semiconductor Materials Facility in Colorado

07/01/2024 | SEMI
SEMI, applauded the United States Department of Commerce's announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support Entegris construction of a state-of-the-art manufacturing center for advanced materials and process solutions for leading-edge semiconductors in Colorado Springs, Colorado.

Indium Corporation’s New Type 6 Jetting Solder Paste Hits Market

06/26/2024 | Indium Corporation
Indium Corporation® is pleased to introduce a new jetting solder paste to join its PicoShot® series of products. PicoShot® NC-6M is a no-clean, halogen-free, Type 6 powder-size material specifically formulated to be compatible with Mycronic jetting systems and Mycronic’s “small dot” ejector.

Altair Announces Material Collaboration with HP

06/25/2024 | Altair
The collaboration will help break down traditional barriers to 3D printing adoption and ultimately help customers better design parts for Multi Jet Fusion and Metal Jet printers.
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