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Traditional Materials, High-Frequency Boards?

06/18/2024 | I-Connect007 Editorial Team
Not long ago, high-frequency and RF boards required specialized laminates, which tend to be costly and difficult to manufacture. But now, high-frequency designers use traditional PCB laminates for certain high-frequency boards. How is this possible? For some insight, we asked Ed Kelley, founder of Four Peaks Innovation and former CTO of Isola, to discuss how traditional materials have improved and what this means to PCB designers and design engineers today.

TTM Technologies Unveils New Xinger High-Performance 50W (AVG) Couplers

05/30/2024 | Globe Newswire
TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies and printed circuit boards (PCBs) has announced the launch of its 5mm x 3.2mm X-Band 8-12 GHz 3dB hybrid coupler and 20dB directional coupler.

Wearable Devices Get Signal Boost from Innovative Material

05/25/2024 | Rice University
A new material that moves like skin while preserving signal strength in electronics could enable the development of next-generation wearable devices with continuous, consistent wireless and battery-free functionality.

Beyond Design: Dielectric Material Selection Guide

05/23/2024 | Barry Olney -- Column: Beyond Design
Materials used for the fabrication of multilayer PCBs absorb high frequencies and reduce edge rates. That loss in the transmission line is a major cause of signal degradation. However, not all of us are designing cutting-edge boards and sometimes we tend to over-specify requirements that can lead to inflated production costs. In this month’s column, I will look at the types of materials commonly used for PCB design and how to select an adequate material to minimize costs.

NASA’s Optical Comms Demo Transmits Data Over 140 Million Miles

04/30/2024 | NASA JPL
NASA’s Deep Space Optical Communications experiment also interfaced with the Psyche spacecraft’s communication system for the first time, transmitting engineering data to Earth.
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