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Cadence Appoints Moshe Gavrielov to Board of Directors

12/13/2024 | Cadence Design Systems
Cadence Design Systems, Inc. announced the appointment of Moshe Gavrielov to its board of directors, effective January 1, 2025. Mr. Gavrielov currently serves as a member of the board of NXP Semiconductors N.V. and Taiwan Semiconductor Manufacturing Company Ltd., as chair of the board of Foretellix and SiMa.ai, and has previously held executive roles at several global technology companies.

Burkle's Marco Schaible Joins VDMA Photovoltaic Equipment Division’s Executive Board

12/13/2024 | Burkle America
The Photovoltaic Production Equipment Department of the VDMA held regular elections at its board meeting on December 5th and confirmed the top management. Prof. Dr. Peter Fath, RCT Solutions GmbH, was re-elected as Chairman of the Board and Dr. Stefan Rinck, Singulus Technologies AG, was re-elected as Deputy Chairman.Burkle America is proud to announce that Marco Schaible, our Vice President of PV and Glass Solutions, has been confirmed as a member of the new Executive Board for the VDMA’s Photovoltaic Production Equipment Division. This appointment reflects Marco’s exceptional expertise and commitment to advancing innovation and competitiveness in the German-European solar machinery industry.

Taiwanese PCB Industry Witnessed Steady Growth of 9.6% in Q3 2024

12/12/2024 | TPCA
The global output value of Taiwanese circuit board enterprises demonstrated steady growth in the third quarter of 2024, reaching NT$227.1 billion, a year-over-year increase of 9.6%.

Fresh PCB Concepts: PCB Plating Process Overview

12/12/2024 | Team NCAB -- Column: Fresh PCB Concepts
In this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as mechanical properties or size limitations of the alternatives, PCBs will remain the standard low-cost interconnection technology. Rapidly increasing performance and functionality requirements of wireless and high-speed devices have challenged the development and implementation of new manufacturing solutions.

Has the Time Finally Come for Tin-nickel Plating?

12/09/2024 | Marcy LaRont, PCB007 Magazine
In the 1980s, Electrochemicals, Inc. (now Electrochemical Products) made a significant shift from furniture and industrial goods to electronics and manufacturing. During this journey, a tin-nickel plating alloy was developed. In 1984, Mike Carano, a young engineer, published a paper on tin-nickel plating alloy, but after some initial attention, the plating solution fell into obscurity. Today, PCB fabrication looks largely the same, yet changes are afoot, chiefly due to the demands for very fine feature capability on printed circuit boards, as well as environmental sustainability. So, in this fascinating conversation with Mike Carano and Happy Holden, we take another look at tin-nickel and its advantages in both performance and sustainability.
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