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The Shaughnessy Report: A Stack of Advanced Packaging Info

12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy Report
It’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.

I-Connect007 Releases New Episode of Meet the Author Podcast: Spotlight on Complex PCB Design

12/10/2024 | I-Connect007
I-Connect007 is thrilled to announce the latest installment of its Meet the Author podcast series, hosted by Nolan Johnson. In this episode, Johnson interviews Scott Miller and Brian White of Freedom CAD, who share their expertise on complex PCB design.

Advanced Packaging and Stackup Design: December 2024—Design007 Magazine

12/09/2024 | I-Connect007 Editorial Team
In this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

12/06/2024 | Marcy LaRont, I-Connect007
This week’s must-reads include a discussion on innovation and embedded components within the layers of a PCB with Accurate Circuit Engineering. We revisit the real cost to manufacture in a case study on how a seemingly small design error can have a dramatic effect on your end customer’s costs. Dan Beaulieu provides this month’s book review highlighting the criticality of fostering creativity in the workplace. Bert Horner of The Test Connection discusses his decision to launch a new, complimentary business venture, The Training Connection; and Ramon Roche of NCAB talks about electric vehicle charging.

Mycronic Introduces New Machine Models to Its High-Performance Pick-And-Place Platform MYPRO A40

12/06/2024 | Mycronic
Mycronic, the leading Sweden-based electronics assembly solutions provider, is introducing two new machine models MYPro A40SX and A40LX to its next-generation MYPro A40 pick-and-place platform, equipped with the all-new MX7 high-speed mounthead technology.
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