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Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 21, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: 3 minutes
He’s back, and in splendid form. Pete’s Starkey’s coverage of the EIPC Summer Conference, which took place June 4-5 at the European Space Centre, The Netherlands, is top notch. Joan Tourné from NextGIn Technologies emphasized that our attention must be focused on the interconnection ability of our PCBs and highlights VeCS as an alternative to the traditional plated-through-hole approach. Finally, Martyn Cauwe of IMEC discusses environmental impact and specifically, the need for a better, parametric approach to quantifying it, something European businesses are being required to do on the regular. Reading Pete’s reviews is almost as good as being there. Check out his Part 1 coverage here.
Looking Into Space: EIPC Summer Conference, Part 2
Published June 18
This second-day write-up of the conference, themed, “Innovative Development of PCB Technology and Design,” kicked off with a compelling presentation by Dr. Evelyne Parmentier, research and development engineer with Dyconex, who broached the question, “Why aren’t we including more of the elements (metals) in the periodic table in our manufacturing?” This was followed by a discussion on sputtering as an alternative method of metalization, something of great interest to many of us.
American Made Advocacy: Changing Leadership and Three Years of Advocacy in D.C.
Published June 18
Travis Kelly, CEO of Isola and the first chair of PCBAA, signs off in his final column this month as he turns the PCBAA reigns over to Shane Whiteside of Summit Interconnect. Recollecting the last three years of advocacy work of which he and PCBAA have been a critical part, he highlights all that remains to be done and how important it is for business leaders to have their voices heard. As he bids Mr. Whiteside much success in this role, he calls out to all industry members to become involved in helping to create a more balanced global supply chain where U.S. businesses and interests can prosper.
Traditional Materials, High-Frequency Boards?
Published June 18
This interview with PCB design guru Kris Moyer and the former CTO for Isola Ed Kelly is an energetic and informational discussion about the evolution of PCB materials and the cross-over we are seeing today between high-speed digital designs and PCB designs for RF applications. RF materials are no longer the only go-to material solution when dealing with RF attributes in a PCB design. Today, this is the middle ground, utilizing and blending different resin systems to achieve low loss and target Dks. This is a great read.
The Critical Role of Materials
Published June 19
As a PCB fabricator, managing your inventory, especially your laminate inventory, is a critical piece for achieving and maintaining financial success in business. If you do everything else right and do this wrong, you will negatively affect your bottom line. In this article from PCB007 Magazine’s May issue, Anaya Vardya of American Standard Circuit shares his approach and best practices regarding this essential part of operations. When managing high-tech, high-mix, low-volume production, the criticality of great supplier relationships and managing necessary risk are all covered in this in-depth interview.
Manufacturing Industry's Path to Innovation and Efficiency Lies in Exponential IT, Says Info-Tech Research Group
Published June 18
Sometimes, a news item resonates deeply with our readers, and this announcement by the Info-Tech Research Group did just that. Speaking to the seemingly incessant search for good information and data that may provide clarity for our business futures, this article showcases the reality that achieving innovation is increasingly and inextricably linked to one’s investment and engagement in IT or technology. Of course, leveraging AI capabilities comes immediately to mind. “Exponential IT,” as it is called in this study, is not the IT of yesteryear. As with all things, strategy will be key in how technology will be used optimally to the greatest advantage and success of manufacturing businesses. This is a quick read focused on your IT management, but if you are a business leader or stakeholder, it is worth two minutes of your time.
Suggested Items
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
I-Connect007 Releases New Episode of Meet the Author Podcast: Spotlight on Complex PCB Design
12/10/2024 | I-Connect007I-Connect007 is thrilled to announce the latest installment of its Meet the Author podcast series, hosted by Nolan Johnson. In this episode, Johnson interviews Scott Miller and Brian White of Freedom CAD, who share their expertise on complex PCB design.
Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
12/09/2024 | I-Connect007 Editorial TeamIn this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/06/2024 | Marcy LaRont, I-Connect007This week’s must-reads include a discussion on innovation and embedded components within the layers of a PCB with Accurate Circuit Engineering. We revisit the real cost to manufacture in a case study on how a seemingly small design error can have a dramatic effect on your end customer’s costs. Dan Beaulieu provides this month’s book review highlighting the criticality of fostering creativity in the workplace. Bert Horner of The Test Connection discusses his decision to launch a new, complimentary business venture, The Training Connection; and Ramon Roche of NCAB talks about electric vehicle charging.
Mycronic Introduces New Machine Models to Its High-Performance Pick-And-Place Platform MYPRO A40
12/06/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, is introducing two new machine models MYPro A40SX and A40LX to its next-generation MYPro A40 pick-and-place platform, equipped with the all-new MX7 high-speed mounthead technology.