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UHDI Fundamentals: UHDI for RF Microwave Applications

07/16/2024 | Anaya Vardya, American Standard Circuits
Ultra high-density interconnect (UHDI) technology has significant potential for RF (radio frequency) microwave applications. Its advantages lie in its ability to provide high-density routing and integration, which are crucial for complex RF circuits. Here are three key UHDI benefits in RF microwave applications:

Ibiden Named Among Continuous Selection of Constituent Companies for FTSE Russell ESG Investment Indexes

07/12/2024 | IBIDEN
IBIDEN Co, Ltd. is pleased to announce that it has been selected for FTSE4Good Index Series for the nineth consecutive year, FTSE Blossom Japan Index for the eighth consecutive year, and FTSE Blossom Japan Sector Relative Index for the third consecutive year.

Don’t Overconstrain Your Board Materials

07/02/2024 | I-Connect007 Editorial Team
When we started planning May’s issue, which centers on the use of traditional laminates in certain high-frequency PCBs, we knew we had to interview Kris Moyer and Ed Kelley together. Kris teaches advanced PCB design classes for IPC, and Ed is the former CTO of Isola and founder of Four Peaks Innovation. What ensued was a wide-ranging discussion on the evolution of “standard” PCB laminates and the recent trend by some OEMs to use these materials in high-frequency and even RF boards.

Wild River Technology's ISI-USB4 Now Supports USB 4.0 Version 2 and DisplayPort 2.1

06/27/2024 | Wild River Technology
Wild River Technology (WRT), the leading supplier of signal integrity measurement and optimization test fixtures for high-speed channels at data rates of up to 25G announced today the availability of a new inter-symbol interference (ISI) loss modeling capability. The ISI-USB4 Advanced Loss Modeling Platform Test Card Set delivers comprehensive support for demanding 25G PAM4 designs.

Overconstrain? Underconstrain? Selecting Materials for High-speed Designs

06/06/2024 | Andy Shaughnessy, Design007 Magazine
When selecting materials for a high-speed design, you need to be very familiar with the materials’ electrical characteristics, as well as the requirements of the PCB you’re designing. There are myriad details that need to be considered during the material selection process, and missing one iota can lead to your job being put on hold. We asked Stephen Chavez, principal technical product marketing manager at Siemens, to share his thoughts on material selection for high-speed designs. Steph discusses material constraints, stackups, and the cut-off point when a “traditional” laminate will (and won’t) work for a high-speed board.
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