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Xanadu, Corning Sign Collaboration Agreement to Advance Fibre Interconnects for Photonic Quantum Computing

03/26/2025 | PRNewswire
Xanadu, a leading photonic quantum computing company, and Corning Incorporated, the global leader in fibre, cable and connectivity, will collaborate to develop customized fibre and fibre-array solutions to enable low-loss networking of photonic quantum computing chips.

AGC Multi Material is Highlighting their Range of Substrate Materials at IPC APEX EXPO 2025

03/04/2025 | AGC Multi Material America
AGC Multi Material America (AMMA) is exhibiting in the IPC Apex exhibition in Anaheim, CA on March 18 - 20, 2025.

Rogers Corporation Launches New Thermoset Laminates for Automotive Radar Sensor Applications

03/03/2025 | Rogers Corporation
Rogers Corporation (NYSE:ROG) announced its latest innovation in dielectric materials: RO4830™ Plus Circuit Materials, which are well suited for cost-sensitive millimeter wave PCB applications, such as 76-81 GHz automotive corner radar sensors.

Incheon National University Study Pioneers Breakthrough in Wireless Charging Technology

02/21/2025 | PRNewswire
The efficiency of wireless charging systems is limited by power loss occurring due to frequency changes in the resonant circuits that enable power transfer.

EIPC 2025 Winter Conference, Day 2: A Roadmap to Material Selection

02/20/2025 | Pete Starkey, I-Connect007
The EIPC 2025 Winter Conference, Feb. 4-5, in Luxembourg City, featured keynotes and two days of conference proceedings. The keynote session and first-day conference proceedings are reported separately. Here is my review of the second day’s conference proceedings. Delegates dutifully assembled bright and early, well-rested and eager to participate in the second day’s proceedings of the EIPC Winter Conference in Luxembourg.
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