Trouble in Your Tank: Understanding Interconnect Defects, Part 1
It’s Only Common Sense: Marketing Isn’t Fluff, It’s Ammunition
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
IPC/iNEMI Webinar on Circularity Challenges in Electronics Manufacturing
July 2, 2024 | iNEMIEstimated reading time: 1 minute
IPC and iNEMI held a workshop with industry experts at the Electronics Goes Green conference in Berlin last month to discuss circularity challenges in electronics manufacturing. The workshop — "There’s no end to a circle: A workshop on how to address circularity challenges in electronics manufacturing" focused on scoping industry solutions to address pressing circularity challenges.
Join us for this webinar to learn more about workshop results and discuss next steps that will lead to work by iNEMI and IPC to assist industry with: Scope of Work statements for new industry standards, tools, and education Ideas for solutions to address the identified problems.
Next steps and additional workshop opportunities. Solutions driven by industry collaboration will help enable efficient and effective adoption of circularity through the electronics manufacturing value chain.
Presenters
Kelly Scanlon, IPC
Lead Sustainability Strategist
Mark Schaffer, iNEMI
Project Manager
Registration
This webinar is for people who attended the EGG workshop as well as those who could not attend but would like to join the conversation. We will be continuing — and building on — the discussion about solutions needed to enable circular economy principles in the electronics industry. The webinar is open to industry; advance registration is required (see link below). If you have any questions or need additional information please contact Mark Schaffer (marks@inemi.org)..
Wednesday, July 17, 2024
10:00-11:00 a.m. EDT (Americas)
4:00-5:00 p.m. CEST (Europe)
10:00-11:00 p.m. CST (China)
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
SEMI Foundation Honors Applied Materials at SEMICON West with 2025 Excellence in Achievement Award for Talent Development
11/04/2025 | SEMIThe SEMI Foundation announced it recognized Applied Materials, Inc. with the Excellence in Achievement Award at SEMICON West 2025 in Phoenix, Arizona, honoring the company’s outstanding leadership and collaboration in building the next generation of semiconductor talent.
Update: Technica USA Begins Exclusive U.S. Distributor for DCT Cleaning Products
11/03/2025 | Technica USATechnica USA is pleased to announce they have begun shipping product for DCT USA, LLC today. Technica recently announced a strategic partnership as the exclusive master distributor of DCT cleaning products in the United States, which became effective November 1, 2025.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.