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Regulatory Review of Renesas’ Acquisition of Altium Concludes
July 2, 2024 | RenesasEstimated reading time: 1 minute
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, and Altium Limited, a global leader in electronics design systems received notification from the Committee on Foreign Investment in the United States (CFIUS) on July 1, 2024 (PDT) that the investigation of the companies’ proposed merger transaction by way of a scheme of arrangement is complete and that there are no unresolved national security concerns with respect to the transaction.
The approval by CFIUS was the last outstanding regulatory authorization required to complete the transaction. All regulatory approvals required for the Scheme in Australia, Germany, Turkey and the United States have been satisfied.
The Scheme remains subject to the satisfaction or (if capable) waiver of certain remaining conditions as set out in the Scheme Booklet, including the meeting of Altium shareholders (“Scheme Meeting”) which will be held at 9:00am on July 12, 2024 (AEST), at which Altium shareholders will vote on the proposed Scheme. If the Scheme is approved by the requisite majority of Altium shareholders, there will be the second court hearing at the Supreme Court of New South Wales (“Court”) on July 18, 2024 (AEST) to consider whether to approve the Scheme.
The implementation date of the Scheme is expected to be August 1, 2024 (JST/AEST), subject to customary closing conditions. An announcement will be made on August 1, 2024 (JST/AEST) when the acquisition is implemented.
All dates following the date of the Scheme Meeting are indicative only and, among other things, are subject to all necessary approvals from the Court.
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Julia McCaffrey - NCAB GroupSuggested Items
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09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
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The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.