-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Taiwan to Receive AV’s Switchblade 300 Loitering Munition Systems
July 3, 2024 | BUSINESS WIREEstimated reading time: 1 minute

The U.S. Department of State announced approval of a possible foreign military sale of AeroVironment (AV) Switchblade® 300 loitering munition systems to Taiwan for an estimated $60.2 million. The proposed sale will bolster Taiwan’s defensive capabilities and supports U.S. national security and economic interests in the Indo-Pacific region.
AV’s combat-proven Switchblade 300 systems have been deployed by the U.S. Army for more than a decade and are currently providing real-time ISR and precision strike support on battlefields in Ukraine. Ideal for use against beyond-line-of-sight targets, Switchblade systems were previously approved by the U.S. Government for use by Ukraine, France, the United Kingdom and additional allies after Russia’s 2022 invasion of Ukraine. The latest iteration of the system – Switchblade 300 Block 20 – features alternative warheads, including an armor penetrating capability, increased target attack angle, and significantly greater battery life, flight endurance, and radio link range.
“Switchblade 300 continues to be a critical weapon employed by the U.S. and its allies to defend homelands and operational forces against adversaries,” said Brett Hush, AV’s senior vice president and general manager for Loitering Munition Systems. “We have proven in steady combat against modern enemies that Switchblade 300 provides forces a competitive edge on the battlefield, introducing precise, long-range fires well beyond their current capabilities.”
The backpackable, lightweight Switchblade 300 offers operators the flexibility to rapidly maneuver on the ground, in and out of vehicles, or within fixed defensive positions prior to launch. Real-time video, GPS coordinates, selectable warheads, and wave-off capabilities provide the operator a proven, reliable asset that can be employed in various domains.
“AV looks forward to supporting the U.S. and Taiwan in rapidly fielding these highly effective weapon systems to deter aggression, defend the airspace and waters around Taiwan, and assist in maintaining political stability,” continued Hush.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/11/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.