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Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress

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Metallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.

Nolan’s Notes: Emerging Trends in 2025

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Rehm Thermal Systems is Exhibiting for the First Time at hy-fcell

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hy-fcell will once again take place in Stuttgart on 8 and 9 October 2024. The leading international trade fair and conference for hydrogen and fuel cell technology is the meeting place for the industry and offers both experts and newcomers the ideal platform to discuss technological advances, transfer knowledge and open up international markets – for the first time, Rehm Thermal Systems will be exhibiting a system for drying fuel cells.

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07/22/2024 | Airbus
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