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DuPont, Zhen Ding Technology Group Sign Strategic Cooperation Agreement to Advance High-End PCB Technology Development

10/30/2024 | DuPont
DuPont and Zhen Ding Technology Group announced they have entered into a strategic cooperation agreement in advanced printed circuit board (PCBs) technology.

Wearable Technology Market worth $152.82 Billion by 2029

10/30/2024 | PRNewswire
The global wearable technology market is expected to be valued at USD 70.30 billion in 2024 and is projected to reach USD 152.82 billion by 2029; it is expected to grow at a CAGR of 16.8% from 2024 to 2029 according to a new report by MarketsandMarkets™.

Flexible Thinking: Musings on High Density Interconnections

10/30/2024 | Joe Fjelstad -- Column: Flexible Thinking
People have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.

Keysight, ADI Partner to Develop GMSLTM Test Methodology

10/30/2024 | BUSINESS WIRE
Keysight Technologies, Inc.  and Analog Devices, Inc. (ADI), a global semiconductor leader, have collaborated to create a comprehensive test solution for Gigabit Multimedia Serial Link (GMSL2TM) devices.

ULVAC Launches Technology Center PYEONGTAEK for Next-Gen Semiconductor Manufacturing

10/30/2024 | JCN Newswire
ULVAC, Inc., the world’s leading comprehensive vacuum manufacturer, has established Technology Center PYEONGTAEK in Pyeongtaek, Gyeonggi-do, South Korea.
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