The Marketing Minute: Cracking the Code of Technical Marketing
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
The Dominican Republic aims to become a Destination for the Semiconductor Industry
July 12, 2024 | Globe NewswireEstimated reading time: 1 minute
Aiming to become the main logistics hub in the region, the Dominican Republic is seeking a new space in its strategic development with the semiconductors industry. This ambition is backed by half a century of continued robust economic growth, social stability, and a vibrant democratic system.
On June 13th, 2024, President Luis Abinader issued Executive Order 324-24 declaring the development of the semiconductor industry in the country as a "high national priority." The Ministry of Industry, Commerce, and MSMEs (MICM) is in charge of developing the National Strategy for the Promotion of the Semiconductor Industry (ENFIS), aiming to position the Dominican Republic as a strategic, competitive, reliable, and secure destination for the global semiconductor industry.
MICM, in partnership with the American Chamber of Commerce of the Dominican Republic (AMCHAMDR), will showcase the country at Semicon West, an event that brings together experts and industry leaders in semiconductors in San Francisco, California, from July 9 to 11.
Semicon West will include presentations regarding the investment climate in the Dominican Republic, the great success it has had in manufacturing operations thanks to its export-oriented no-tax Free Zone regime, and the country’s potential to achieve new milestones in emerging high-tech fields.
Geographical and political proximity to the United States, a favorable policy framework, a cost-competitive environment, modern infrastructure, as well as excellent logistical services, are some of the advantages that make the country an attractive market for investment. The Dominican Republic has become a reliable partner for the medical and electronic devices industries and is poised to position itself as a manufacturing and logistics hub for the semiconductor industry.
The Information Technology and Innovation Foundation (ITIF), in Washington, DC, published a study on January 2024 titled “Assessing the Dominican Republic’s Readiness to Play a More Significant Role in the Global Value Chains of Semiconductors and Printed Circuit Boards.” And in May 2024, MICM established a strategic partnership with Purdue University through a Memorandum of Understanding for the development of the Dominican workforce in microelectronics and semiconductors.
For more information about the Dominican Republic's participation in Semicon West, visit us at Booth No. 6813.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.