EV Group’s EVG 880 LayerRelease System Wins 2024 Best of West Award
July 15, 2024 | SEMIEstimated reading time: 1 minute
The EVG®880 LayerRelease™ system from EV Group (EVG) has won the 2024 Best of West award, SEMI and Semiconductor Digest announced at SEMICON West 2024 at the Moscone Center in San Francisco. Presented by SEMI and Semiconductor Digest each year, the Best of West award recognizes innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability.
The EVG®880 LayerRelease™ system is the first high volume manufacturing (HVM) equipment platform incorporating EVG’s innovative LayerRelease™ technology. It enables nanometer-precision release of bonded, deposited or grown layers from silicon carrier substrates using an IR laser coupled with specially formulated inorganic release materials. As a result, it eliminates the need for glass carriers—enabling ultra-thin chiplet stacking for advanced packaging, as well as ultra-thin 3D layer stacking for front-end processing, including advanced logic, memory and power device formation, to support future 3D integration roadmaps.
“The EVG 880 LayerRelease system enables an important step forward for 3D integration,” said Pete Singer, Editor-in-Chief of Semiconductor Digest. By enabling 3D stacking of ultra-thin layers, the EVG880 LayerRelease system allows for shorter distances between stacked dies, which in turn allows faster data exchange from one die to another while reducing power consumption. “Congratulations to EV Group for again winning the Best of West competition.” The company previously won for its LITHOSCALE Maskless Exposure System in 2021.
EV GroupEV Group is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.
Suggested Items
OSI Systems Receives $34 Million Contract for Cargo and Vehicle Inspection Systems
07/11/2025 | BUSINESS WIREOSI Systems, Inc. announced that its Security division has been awarded a contract worth approximately $34 million by an international customer.
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.
OSI Systems Lands $17 Million Order for Cargo and Vehicle Inspection Systems
07/07/2025 | BUSINESS WIREOSI Systems, Inc. announced that its Security division received an order valued at approximately $17 million from an international customer for cargo and vehicle inspection systems.
KYOCERA AVX Releases New 3DB Hybrid Couplers
07/04/2025 | PRNewswireKYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released a new line of integrated thin film (ITF) hybrid couplers designed to facilitate the continued evolution of high-frequency wireless systems in industrial, automotive, telecommunications, and telemetry applications.
Accenture Acquires SYSTEMA to Drive Manufacturing Automation for Semiconductor Clients
07/02/2025 | AccentureAccenture has acquired SYSTEMA, a provider of software solutions and consulting services for manufacturing automation, headquartered in Dresden, Germany.