TRI at SMTA Chihuahua Expo & Tech Forum 2024
July 15, 2024 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, is excited to announce its participation in the SMTA Chihuahua Expo & Tech Forum 2024, held at the Sheraton Chihuahua Soberano scheduled to take place on August 15, 2024.
Visit TRI's stand to discuss how TRI's One Stop Solution for PCB Assembly Testing and Inspection is reshaping the SMT Industry. TRI's product line includes Optical Inspection (SPI, AOI, and AXI) and Board testing (ICT and MDA).
TRI's AXI solutions, TR7600 Series, offer fast image reconstruction and full-coverage defect detection capabilities. These innovative features, combined with a broad range of specifications, including High Multi-Resolution 2 - 30 µm, AI-powered inspection algorithms, adjustable imaging parameters, and inline fine-tuning capabilities, make the TR7600 Series a compelling choice. Unlike competitors, TRI's X-ray inspection solutions secure the sample on the conveyor while inspecting it, preventing further damage.
The TR7600 Series satisfies the inspection needs of the electronics manufacturing industries such as Advanced Packaging, Automotive, Aerospace, Telecommunications, and Medical. The AXI series is also capable of inspecting large boards of up to 2100 x 510 mm. The 3D CT AXI equipment ensures meticulous inspection across various components, including BGA, QFN, SiP, PTH, PoP, C4 Bumps, and more.
The TRI solutions facilitate data exchange between the production line and the MES system of your choice, enabling data traceability for the connected factory. TRI's solutions are compliant with Industry 4.0 standards, such as IPC-Hermes-9852, IPC-DPMX, and Connected Factory Exchange (IPC-CFX).
Visit TRI's stand at the SMTA Chihuahua & Tech Forum 2024 to discover why the leading EMS companies choose TRI as their Test and Inspection Partner.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Real Time with... SMTAI 2025: Koh Young's Innovations in SMT Inspection Technology
10/30/2025 | Real Time with...SMTAIJoel Scutchfield discusses his background as well as Koh Young's advancements in inspection technology. The conversation covers various inspection systems, including the flagship Zenith 2 system and recent software upgrades.
Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
10/28/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany.
New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection
10/22/2025 | I-Connect007In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
10/14/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.

 
                         
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             American Made Advocacy: Smart Policies Can Ensure AI Data Centers Are Secure
                                         American Made Advocacy: Smart Policies Can Ensure AI Data Centers Are Secure Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
                                         Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
                                         Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman





 
                     
                 
                    