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Hon Hai Research Institute Launches Traditional Chinese LLM With Reasoning Capabilities

03/13/2025 | PRNewswire
Hon Hai Research Institute announced today the launch of the first Traditional Chinese Large Language Model (LLM), setting another milestone in the development of Taiwan's AI technology with a more efficient and lower-cost model training method completed in just four weeks.

Summit Interconnect Announces Key Executive Appointments: Sean Patterson Named CTO, Michael Norman Joins as President and COO

03/06/2025 | Summit Interconnect, Inc.
Summit Interconnect, a leading provider of advanced PCB manufacturing solutions, is pleased to announce two key leadership updates to its executive team.

GlobalFoundries, MIT Collaborate to Advance Research and Innovation on Essential Chips for AI

03/04/2025 | GlobalFoundries
GlobalFoundries (GF) and the Massachusetts Institute of Technology (MIT) announced a new master research agreement to jointly pursue advancements and innovations for enhancing the performance and efficiency of critical semiconductor technologies.

Pusan National University Develops One-Step 3D Microelectrode Technology for Neural Interfaces

02/28/2025 | PRNewswire
Neural interfaces are crucial in restoring and enhancing impaired neural functions, but current technologies struggle to achieve close contact with soft and curved neural tissues. Researchers at Pusan National University have introduced an innovative method—microelectrothermoforming (μETF)—to create flexible neural interfaces with microscopic three-dimensional (3D) structures.

SEMICON Southeast Asia 2025 Celebrates 30 Years of Innovation Through Collaboration

02/25/2025 | SEMI
SEMICON Southeast Asia (SEA), the region’s premier global electronics manufacturing and supply chain event, will take place from 20-22 May at the Sands Expo and Convention Centre in Singapore. Marking its 30th anniversary and spotlighting the theme of Stronger Together – Collaborating to Navigate Uncertainties and Fostering Resilience,
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