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Koh Young Brings Smart AI Solutions to productronica India 2026 South and Expands Regional Presence

08/06/2026 | Koh Young
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will place its Smart AI Solutions at the center of its participation in productronica India 2026 South, September 16–18 at the Bangalore International Exhibition Centre in Bengaluru.

IBIDEN Raises FY2026 Outlook on Strong AI Semiconductor Demand

08/05/2026 | IBIDEN
IBIDEN reported strong first-quarter fiscal 2026 performance, driven by robust demand for GPUs, high-end CPUs, and AI-related semiconductor package substrates.

Removing the Bottleneck: ZOT's Transition to Direct Imaging

08/05/2026 | Marcy LaRont, I-Connect007
For many PCB fabricators, solder mask imaging can become one of the biggest constraints on production. Traditional exposure methods often involve lengthy setup times, multiple process steps, and opportunities for registration errors, leading to costly rework. ZOT Engineering Ltd., a UK-based contract electronics manufacturer specializing in PCB fabrication and assembly, recently modernized this part of its process by partnering with Schmoll Maschinen to deploy a maskless direct imaging (MDI) system.

Northrop Grumman Enters Into $3 Billion Landmark Agreements to Accelerate Missile Interceptor Production

08/04/2026 | Northrop Grumman
Northrop Grumman has signed two multi-year framework agreements totaling over $3 billion to further power the Arsenal of Freedom

Lockheed Martin Awarded $58.6B Multiyear PAC-3 MSE Contract

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The U.S. government awarded Lockheed Martin a seven-year undefinitized contract action (UCA) modification for up to $53.86 billion for PAC-3 Missile Segment Enhancement (MSE) interceptors, supporting the Department of War's Acquisition Transformation Strategy.
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