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Siemens Expands EDA Software Access Through EuroCDP Project

05/14/2026 | Siemens
Siemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe's semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.

More Than a Field Trip: Young Students Step into the World of Electronics and Semiconductors

05/13/2026 | Michigan Tech Electronics Hub
The energy is electric at Michigan Technological University as 164 fourth graders from Michigan’s western Upper Peninsula trade their traditional desks for a day of high-tech exploration. The students are here to pilot Stories & Semiconductors, a new educational series. By following the adventures of characters who solve problems through electronics, young students don’t just read about technology; they build it themselves.

FPGA AI Chip Market to Surpass $100M Shipments by 2031 Amid Rapid ASP Decline

05/07/2026 | JPR
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U.S. Semiconductor Industry Convenes at Glass4Chips Summit

05/04/2026 | NY CREATES
The 2026 Glass4Chips Summit will bring together leaders and innovators across industry, academia, and government to address a framework for accelerating the adoption of glass substrates in next-generation semiconductor manufacturing and packaging.

Infineon Brings Industrialization Expertise to European Quantum Chip Pilot Lines

05/04/2026 | Infineon
Infineon Technologies AG is a core industrial partner in accelerating Europe's move toward practical – and ultimately, commercially viable – quantum computing by contributing its world-class engineering and manufacturing expertise to three quantum pilot lines projects: SUPREME, CHAMP-ION and SPINS.
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