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Tom Edman Leads IPC Board of Directors
July 17, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: 2 minutes
 
                                                                    IPC elected several new board members at IPC APEX EXPO in April, including new Board Chair Tom Edman, CEO of TTM, who assumes the role from Bob Neves, CTO and chair of Microtek Laboratories. Tom and TTM have long been active in many facets of IPC. I caught up with Tom and asked him about his new board appointment, IPC, and the industry he serves. He emphasizes IPC’s work in standards and advocacy as especially important for our industry.
Tom, from your perspective, what does it mean to chair the IPC Board? What is your role, and how long is your term?
My term is for two years. I am thrilled to be chair at this exciting time with IPC as the organization continues its work on behalf of electronics manufacturers. The vision for the organization will continue to allow IPC to build on its foundation of standards development while strengthening key areas such as workforce development, policy representation, sustainability, and design.
Why is involvement in IPC important for industry companies? What would you tell someone who may be considering membership?
I would explain the critical role that IPC plays in representing our industry and the direct help that IPC provides with critical industry standards, training materials, funding opportunities, policy support, and networking opportunities, among other benefits, all with a competitive dues structure. The breadth of IPC’s global capabilities is astounding to me and has served to benefit TTM as well as so many other electronics manufacturers.
As a leader and ambassador for IPC over these next two years, what are your goals?
Frankly, my goal is to aid John Mitchell and the other executives at IPC in implementing a growth strategy that is truly impressive. John and the team have the support of an engaged and energetic board in realizing their goals. We just need to support these goals in any way possible.
What advice do you have from a leadership and strategy standpoint for small business owners who may be trying to decide whether to participate in the next evolution of PCB fabrication?
I would suggest that we all have a role to play in supporting our customers. As our customers move to new designs that require increased capabilities, I believe that everyone in the industry will benefit by investing strategically in capabilities that enhance their growth. New designs will coexist with older designs, which, hopefully, will offer all of us profitable opportunities.
This conversation appeared in the June 2024 issue of PCB007 Magazine.
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TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
                                             Standard of Excellence: Speed vs. Quality in Customer Service
                                         Standard of Excellence: Speed vs. Quality in Customer Service Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
                                         Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
                                         Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control





 
                     
                 
                    