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Happy’s Tech Talk #42: Applying Density Equations to UHDI Design

08/19/2025 | Happy Holden -- Column: Happy’s Tech Talk
With the need for faster speeds, more parts on an assembly, and the trend to make things smaller for portability, the printed circuit design and layout process is both creative and challenging. The process involves “applying the density equation” while considering certain boundary conditions, such as electrical and thermal performance. Unfortunately, many designers don’t realize there is a mathematical process to laying out a printed circuit.

Beyond Design: Effective Floor Planning Strategies

08/20/2025 | Barry Olney -- Column: Beyond Design
Component placement on a printed circuit board is more involved than simply fitting parts into available space. It plays a pivotal role in determining the board’s overall manufacturability, performance, reliability, and cost. Poor placement can compromise even the most meticulously designed PCB. Effective component placement alleviates mechanical stress, promotes efficient thermal management, and helps prevent excessive heat buildup.

Global Sourcing Spotlight: How to Evaluate Supplier Capabilities Worldwide

08/20/2025 | Bob Duke -- Column: Global Sourcing Spotlight
In global sourcing, the difference between a competitive edge and a catastrophic disruption often comes down to how well you vet your suppliers. Sourcing advanced PCBs, precision components, or materials for complex assemblies demands diligence, skepticism, and more than a little time on airplanes. Here’s how to do your due diligence when evaluating international suppliers and why cutting corners can cost you more than money.

American Made Advocacy: Where’s the Budget for a Modern Military Run on Microelectronics?

08/19/2025 | Shane Whiteside -- Column: American Made Advocacy
In a world of peer threats and urgent transformation, having secure, trusted, and reliable microelectronics is non-negotiable. While largely hidden, microelectronics are the ubiquitous enablers of modern defense platforms. Nothing in the current American arsenal flies, floats, or fights without a technology stack that includes a semiconductor, an integrated circuit substrate, and a printed circuit board.

U.S. Departments of Commerce, Labor, Education Unveil Workforce Development Strategy to Fuel ‘Golden Age’ of the American Economy

08/18/2025 | U.S. Departments of Commerce, Labor, Education
The U.S. Departments of Commerce, Labor, and Education published a milestone report, America’s Talent Strategy: Equipping American Workers for the Golden Age, which presents a bold vision and concrete actions to transform the federal government’s approach to workforce development.
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