-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCounterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
A Culture of Thriving
One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Merck KGaA, Darmstadt, Germany, to Acquire Unity-SC
July 19, 2024 | Merck KGaAEstimated reading time: 2 minutes
Merck KGaA, Darmstadt, Germany, a leading science and technology company, intends to acquire Unity-SC, a provider of metrology and inspection instrumentation for the semiconductor industry. The transaction amount includes a payment of € 155 million as well as further milestone-based payments. Based in Montbonnot-Saint-Martin near Grenoble, France, Unity-SC employs approximately 160 people, of whom 70 work in research & development.
“The acquisition of Unity-SC complements our science and technology-driven portfolio for the semiconductor industry. It strengthens our ability to benefit from the growth opportunities of Artificial Intelligence as an integrated solutions provider for our customers in developing next-generation chips,” said Belén Garijo, Chair of the Executive Board and CEO of Merck KGaA, Darmstadt, Germany.
The highly precise metrology measurement devices of Unity-SC make it possible to further optimize the quality, yield, and manufacturing costs of chips used in applications related to Artificial Intelligence (AI), High-Performance Computing (HPC), and High-Bandwidth Memory (HBM). As quality requirements in the semiconductor industry are particularly high, measuring and evaluating physical properties are crucial steps in quality control for the production of modern chips. Among other things, Unity-SC specializes in the testing of chips produced via “Advanced Packaging” and “Heterogeneous Integration”. In both these processes, numerous smaller chips – also known as chiplets – are stacked in a very small space to form a mostly three-dimensional structure. This results in high-performance chips for the most demanding fields of application, such as AI data centers, autonomous vehicles, 5G, smartphones, and virtual reality.
The combination of Unity-SC's measurement technologies with the offering of Merck KGaA, Darmstadt, Germany, in the field of semiconductor materials will contribute to the development of computer chips required for the next steps in innovating AI and other applications. “We are convinced that 3D metrology tools will further advance the semiconductor industry. Adding metrology to our portfolio allows us to provide more materials and more solutions that effectively solve our customers challenges in developing ever faster, more powerful, and more efficient chips,” said Kai Beckmann, Member of the Executive Board of Merck KGaA, Darmstadt, Germany, and CEO Electronics.
“We can benefit from the broad knowledge Merck KGaA, Darmstadt, Germany, has in semiconductor materials manufacturing and their extensive optical expertise in light manipulation. Together with Merck KGaA, Darmstadt, Germany, we can create high value solutions to serve our common customers. We are looking forward to becoming an integral part of a global company with close customer relationships and an extensive offering to the semiconductor industry,” said Dan Lee, CEO of Unity-SC.
The intended acquisition requires a French works council's consultation and would remain subject to regulatory approval and other closing conditions. Subject to meeting the relevant requirements, it is expected to be completed by the end of 2024.
Suggested Items
Flexible Thinking: Musings on High Density Interconnections
10/30/2024 | Joe Fjelstad -- Column: Flexible ThinkingPeople have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.
SIA Applauds CHIPS Incentives for Hemlock Manufacturing Expansion in Michigan
10/22/2024 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Hemlock Semiconductor (HSC).
SIA Applauds CHIPS Act Incentives for Wolfspeed Manufacturing in North Carolina and New York
10/16/2024 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Wolfspeed.
Iridium to Collaborate with Nordic Semiconductor on Iridium NTN Direct integration
10/11/2024 | PRNewswireIridium Communications Inc., a leading provider of global voice and data satellite communications, announced its collaboration with Nordic Semiconductor for early integration of its Iridium NTN Direct℠ service into Nordic's LTE-M/NB-IoT modules and chipsets.
CHIPS Act Falls Short Without Focus on Workforce Training
10/02/2024 | David Hernandez, VP of Education, IPCBillions of dollars of funding from the CHIPS and Science Act are going to the construction of new semiconductor fabrication plants (“fabs”). However, that investment will fail to meet its full potential unless we also focus on building something equally important: talent pipelines for the entire electronics manufacturing ecosystem.