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LG Innotek to Build FC-BGA into 700 Million USD Business with State-of-the-art Dream Factory

05/01/2025 | PR Newswire
LG unveiled the Dream Factory, a hub for the production of FC-BGAs (Flip Chip Ball Grid Arrays), the company's next-generation growth engine, to the media for the first time and announced it on the 30th April.

BEST Inc. Reports Record Demand for EZReball BGA Reballing Process

05/01/2025 | BEST Inc.
BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.

ASMPT Demonstrates Technology Leadership in SMT Assembly

04/09/2025 | ASMPT
The rapid development of artificial intelligence is driving the demand for high-performance processors and placing great demands on electronics manufacturing.

IPC Releases Latest List of Standards and Revisions

03/12/2025 | IPC
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.

TopLine Bringing Answers, New Ideas to APEX 2025

02/04/2025 | TopLine
TopLine® Corporation’s engineers will discuss groundbreaking technologies and product solutions at the upcoming IPC APEX EXPO 2025 this coming March 18-20 at the Anaheim Convention Center in California.
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