Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

Semiconductor Packaging Materials Market to Hit $93.7B by 2031, Driven by AI and Chiplet Demand

05/22/2026 | openPR
The global Semiconductor and IC Packaging Materials Market reached USD 43.1 billion in 2023 and is expected to reach USD 93.7 billion by 2031, growing at a CAGR of 10.2% during the forecast period of 2024-2031.

AT&S Expands Capacity for AI Substrates

05/21/2026 | AT&S
As increasingly more computing power is required in the field of artificial intelligence, demand by a key customer for high-end IC substrates of AT&S is growing.

EDIP Opens the Door: EU Funding Now Available for Defence Electronics Including PCBs and Substrates

04/21/2026 | Alison James and Chris Mitchell, Global Electronics Association
The European Commission has published a call for proposals under the European Defence Industry Programme (EDIP), and for European electronics manufacturers the message is clear: this is real money for real capacity, and PCBs and IC substrates are explicitly in scope. EDIP's Industrial Reinforcement Actions (IRA) dedicate €122.25 million to key electronic components, covering guidance electronics, propulsion electronics, RF and laser modules, multispectral cameras, avionics, PCBs and IC substrates, lithium-ion polymer batteries, power electronics, and critical semiconductor building blocks

IC Substrates vs. UHDI: The Future of Interconnect

03/15/2026 | Marcy LaRont, I-Connect007
Advanced packaging is driving feature sizes below 50 microns, forcing IC substrates and UHDI PCBs into overlapping territory. Following his presentation at the Pan-European Design Conference (PEDC) in January, Jan Pedersen, director of technology at NCAB Group, spoke with us about how heterogeneous integration, evolving HDI roadmaps, and supply chain pressures are shaping the next phase of advanced packaging.

UHDI, AI, and RF Materials: Signals From the Next Phase of Advanced Packaging

03/11/2026 | I-Connect007
The upcoming issue of Advanced Electronics Packaging Digest explores several developments shaping the future of advanced electronics, from the convergence of IC substrates and ultra-high-density interconnect (UHDI) PCBs to the growing influence of artificial intelligence on semiconductor packaging and the materials science behind high-frequency system performance.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in